Patents by Inventor Raiyomand Aspandiar
Raiyomand Aspandiar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11894474Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.Type: GrantFiled: September 6, 2019Date of Patent: February 6, 2024Assignee: Intel CorporationInventors: Priyanka Dobriyal, Ankur Agrawal, Susheel Jadhav, Quan Tran, Raghuram Narayan, Raiyomand Aspandiar, Kenneth Brown, John Heck
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Publication number: 20220416503Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer thermally coupled with P node above a quantum well and extending substantially under a heat sink, and a bottom metal layer thermally coupled with an N node, where the top metal layer and the bottom metal layer are not electrically coupled. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 24, 2021Publication date: December 29, 2022Inventors: Priyanka DOBRIYAL, Aditi MALLIK, Saeed FATHOLOLOUMI, Ankur AGRAWAL, Anna PRAKASH, Hemant Mahesh SHAH, Raiyomand ASPANDIAR, Neil Raymund CARANTO
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Publication number: 20210074866Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.Type: ApplicationFiled: September 6, 2019Publication date: March 11, 2021Inventors: Priyanka DOBRIYAL, Ankur AGRAWAL, Susheel JADHAV, Quan TRAN, Raghuram NARAYAN, Raiyomand ASPANDIAR, Kenneth BROWN, John HECK
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Patent number: 7131193Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.Type: GrantFiled: May 17, 2004Date of Patent: November 7, 2006Assignee: Intel CorporationInventors: Arjang Fartash, Christopher D. Combs, Raiyomand Aspandiar, Tom E. Pearson
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Patent number: 6906268Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.Type: GrantFiled: December 14, 2001Date of Patent: June 14, 2005Assignee: Intel CorporationInventors: Arjang Fartash, Christopher D. Combs, Raiyomand Aspandiar, Tom E. Pearson
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Patent number: 6875931Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-expandable member and a retainer member. Being formed from a heat-expandable material, the heat-expandable member is coupled with the retainer member and is disposed about a periphery thereof. The retainer member is configured to be coupled with a component and, when the component is assembled onto a double-sided printed circuit board, to be received by an opening formed in the double-sided printed circuit board. The heat-expandable member is configured to expand during assembly of the component, engaging an inner surface that defines the opening. Thereby, the component is retained and supported when the double-sided printed circuit board is subsequently inverted, populated, and reflowed.Type: GrantFiled: July 18, 2002Date of Patent: April 5, 2005Assignee: Intel CorporationInventors: Christopher D. Combs, Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson
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Publication number: 20050014419Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.Type: ApplicationFiled: August 12, 2004Publication date: January 20, 2005Inventors: Tom Pearson, George Arrigotti, Christopher Combs, Raiyomand Aspandiar
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Publication number: 20040209508Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.Type: ApplicationFiled: May 17, 2004Publication date: October 21, 2004Inventors: Arjang Fartash, Christopher D. Combs, Raiyomand Aspandiar, Tom E. Pearson
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Patent number: 6791189Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.Type: GrantFiled: December 5, 2002Date of Patent: September 14, 2004Assignee: Intel CorporationInventors: Tom E. Pearson, Christopher D. Combs, Arjang Fartash, Raiyomand Aspandiar
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Patent number: 6764325Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.Type: GrantFiled: May 20, 2002Date of Patent: July 20, 2004Assignee: Intel CorporationInventors: George Arrigotti, Raiyomand Aspandiar, Christopher D. Combs, Tom E. Pearson
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Patent number: 6691407Abstract: A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a coupling member extending from said component within a channel formed in said adhesive body such that the coupling member is engaged with at least one engaging member, said at least one engaging member each extending into said channel from an internal surface defining said channel. The component is then assembled onto a printed circuit board and adhered onto the printed circuit board via the adhesive body when the adhesive body is in semi-liquid state.Type: GrantFiled: December 13, 2001Date of Patent: February 17, 2004Assignee: Intel CorporationInventors: Tom E. Pearson, Christopher D. Combs, Arjang Fartash, Raiyomand Aspandiar
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Publication number: 20040011557Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-expandable member and a retainer member. Being formed from a heat-expandable material, the heat-expandable member is coupled with the retainer member and is disposed about a periphery thereof. The retainer member is configured to be coupled with a component and, when the component is assembled onto a double-sided printed circuit board, to be received by an opening formed in the double-sided printed circuit board. The heat-expandable member is configured to expand during assembly of the component, engaging an inner surface that defines the opening. Thereby, the component is retained and supported when the double-sided printed circuit board is subsequently inverted, populated, and reflowed.Type: ApplicationFiled: July 18, 2002Publication date: January 22, 2004Inventors: Christopher D. Combs, Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson
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Publication number: 20030216066Abstract: The present invention relates to apparatus and methods for minimizing open electrical connections between carrier substrates and components connected thereto that occur due to sag in the substrate incurred due to exposure to an increasing heat profile encountered to secure the component to the substrate. A zero insertion force heat activated retention pin expands or bends during the temperature increase, creating an upward force on the printed circuit board. This upward force counters the downward sag forces and enables the carrier substrate to maintain a coplanar relationship with the component being connected.Type: ApplicationFiled: May 20, 2002Publication date: November 20, 2003Inventors: George Arrigotti, Raiyomand Aspandiar, Christopher D. Combs, Tom E. Pearson
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Publication number: 20030111259Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.Type: ApplicationFiled: December 5, 2002Publication date: June 19, 2003Inventors: Tom E. Pearson, Christopher D. Combs, Arjang Fartash, Raiyomand Aspandiar
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Publication number: 20030111258Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.Type: ApplicationFiled: December 13, 2001Publication date: June 19, 2003Inventors: Tom E. Pearson, Christopher D. Combs, Arjang Fartash, Raiyomand Aspandiar
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Publication number: 20030111260Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.Type: ApplicationFiled: December 14, 2001Publication date: June 19, 2003Inventors: Arjang Fartash, Christopher D. Combs, Raiyomand Aspandiar, Tom E. Pearson
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Patent number: 6472612Abstract: A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first strip and the second strip are made of different metals. A first trace and a second trace are fabricated on a second layer to extend the junction to a first trace pad and a second trace pad, respectively. The first and second traces are fabricated on a second layer. The first and second traces have a first end one and a second end one, respectively. The first end one is connected to the first strip using a first via and the second end one is connected to the second strip using a second via. A first wire is inserted to the first via and a second wire to the second via to measure the temperature of the PCB.Type: GrantFiled: March 30, 2001Date of Patent: October 29, 2002Assignee: Intel CorporationInventors: Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson, Christopher D. Combs
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Publication number: 20020139575Abstract: A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first strip and the second strip are made of different metals. A first trace and a second trace are fabricated on a second layer to extend the junction to a first trace pad and a second trace pad, respectively. The first and second traces are fabricated on a second layer. The first and second traces have a first end one and a second end one, respectively. The first end one is connected to the first strip using a first via and the second end one is connected to the second strip using a second via. A first wire is inserted to the first via and a second wire to the second via to measure the temperature of the PCB.Type: ApplicationFiled: March 30, 2001Publication date: October 3, 2002Inventors: Arjang Fartash, Raiyomand Aspandiar, Tom E. Pearson, Christopher D. Combs