Patents by Inventor Raj Kumar Agrawal

Raj Kumar Agrawal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5804018
    Abstract: A panel assembly and method for manufacturing the panel assembly, especially adapted for use in vehicles, includes a panel of predetermined size and geometry wherein a surface of the panel to receive a gasket is primed using a material especially adapted to prepare the panel surface to bond with the gasket. The desired gasket profile is molded separately from the panel from a polymeric material. Following formation of the gasket, the panel is located thereon and pressed into intimate contact with the gasket for a prescribed period of time. The panel and attached panel are removed as an assembly. Additional or optional steps may be followed including preheating the panel and primed surface prior to bonding to shorten the cycle time and improve adhesion. Moreover, heat may be applied to the contact boundary between the panel and gasket substantially simultaneously with the application of pressure. The steps of heating and applying pressure may be repeated to insure proper adhesion.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: September 8, 1998
    Assignee: Donnelly Corporation
    Inventors: Daniel J. Fisher, Raj Kumar Agrawal, Douglas Crank, John W. Carter
  • Patent number: 5707473
    Abstract: A method for bonding an attachment member to a substrate substantially simultaneously with the formation of a sealing member, and a panel assembly made according to the method. The method includes the steps of applying an adhesive to either the attachment member or the substrate, or both, and holding or otherwise retaining the attachment member against the substrate. A sealing member is deposited on the substrate and encapsulates at least a portion of the attachment member. Heat, generated by the polymeric material or added by an external source, causes the adhesive to cure, creating a strong secure bond between the attachment member and the substrate. The attachment member may then be used to mount the substrate to another surface and securely fixed thereto by an adhesive adapted to bond the surface and attachment member together.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: January 13, 1998
    Assignee: Donnelly Corporation
    Inventors: Raj Kumar Agrawal, Niall R. Lynam