Abstract: A novel cooling system is disclosed. It includes one or more thermoelectric (TE) modules, each TE module having at least one semiconductor element located between two ceramic plates. The ceramic plates also include one or more electrodes. The cooling system further includes one or more heat exchangers, where the heat exchangers are in contact with at least one ceramic plate. In addition, the system includes one or more solid desiccant-based dehumidification compartments. Further, the cooling system is configured to direct air over both the TE modules and the desiccant dehumidifier.

Abstract: The presently disclosed subject matter relates to enhanced dry-cooling systems and methods. More specifically, the presently disclosed subject matter relates to enhanced dry-cooling systems for increasing power plant efficiency and output. One embodiment of the present disclosure is directed to dry-cooling system for increasing power plant efficiency and output. The dry-cooling system comprises an air-cooled condenser and an air cooling system in fluid communication with the air-cooled condenser.

Abstract: The presently disclosed subject matter relates to enhanced dry-cooling systems and methods. More specifically, the presently disclosed subject matter relates to enhanced dry-cooling systems for increasing power plant efficiency and output. One embodiment of the present disclosure is directed to dry-cooling system for increasing power plant efficiency and output. The dry-cooling system comprises an air-cooled condenser and an air cooling system in fluid communication with the air-cooled condenser.