Patents by Inventor Raj Mohindra
Raj Mohindra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6799583Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.Type: GrantFiled: May 13, 1999Date of Patent: October 5, 2004Inventors: Suraj Puri, Joseph Medeiros, Jr., Raj Mohindra
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Patent number: 6491043Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: December 11, 2001Date of Patent: December 10, 2002Assignee: SCD Mountain View, Inc.Inventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Publication number: 20020043272Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: ApplicationFiled: December 11, 2001Publication date: April 18, 2002Applicant: SCD Mountain View, Inc.Inventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Jeffrey Nowell
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Patent number: 6352082Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: September 21, 1998Date of Patent: March 5, 2002Assignee: SCD Mountain ViewInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson Sr., Jeffrey Nowell
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Publication number: 20020011254Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.Type: ApplicationFiled: May 13, 1999Publication date: January 31, 2002Inventors: SURAJ PURI, JOSEPH MEDEIROS, RAJ MOHINDRA
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Patent number: 6312597Abstract: The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H2O2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H2O2 injection unit provides a local source of H2O2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process. The gas filtering system provides clean gas to the rinsing unit and to the injection units.Type: GrantFiled: December 1, 1995Date of Patent: November 6, 2001Assignee: SCD Mountain View, Inc.Inventors: Raj Mohindra, Abhay K. Bhushan, Rajiv Bhushan, Suraj Puri
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Patent number: 6158446Abstract: A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: September 4, 1998Date of Patent: December 12, 2000Assignee: FSI InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 6047717Abstract: An improved mandrel device (100) and method. The mandrel device (100) has an elongated member (117) for supporting a plurality of hard disks, for example. The elongated member (117) includes an inner member (107) that is defined between a pair of outer members (105), where each of the members have ridges (103) defined thereon. The combination of these members and ridges are used to support a plurality of disks that do not touch each other during, for example transportation.Type: GrantFiled: April 29, 1998Date of Patent: April 11, 2000Assignee: SCD Mountain View, Inc.Inventors: Rajiv Bhushan, Ru Chang, Raj Mohindra, Vincent Chiu, Dong T. Tran
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Patent number: 6045621Abstract: A method for cleaning an object. The method (400) includes immersing (420) an object in a liquid comprising water, which can be ultra-clean. The object has a front face, a back face, and an edge. The method includes providing (450) a cleaning enhancement substance (e.g., trace amount of polar organic compound, surfactant, ammonia bearing compound) into the liquid. In one embodiment, the cleaning enhancement substance can form a liquid film, such as a monolayer overlying an upper surface or level of the liquid. The method also includes providing a substantially particle free environment (e.g., ultra-clean gas, ultra-clean non-reactive gas) adjacent to the front face and the back face of the object as the liquid including the cleaning enhancement substance is being removed.Type: GrantFiled: October 26, 1998Date of Patent: April 4, 2000Assignee: SCD Mountain View, Inc.Inventors: Suraj Puri, Raj Mohindra
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Patent number: 6004399Abstract: A method is described for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance also is included. It is believed that the cleaning enhancement substance dopes any liquid adhered to the front and back faces of the wafer to cause a concentration gradient of the cleaning enhancement substance in the liquid and accelerate removal of the adhered liquid off of the water.Type: GrantFiled: January 15, 1997Date of Patent: December 21, 1999Assignee: Cypress Semiconductor CorporationInventors: Kaichiu Wong, Krishnaswamy Ramkumar, Hanna Bamnolker, Suraj Puri, Rajiv Bhushan, David Wong, Gary Elmore, Raj Mohindra
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Patent number: 5988189Abstract: A cleaning system (1, 5) having multiple cleaning chambers (200) is provided. Each cleaning chamber (200) includes an interior region sufficient for immersing a carrier (242), which has at least one wafer disposed therein, into an ultra-clean liquid. The cleaning chamber (200) also has an inlet operably coupled to the interior region to introduce a gas into the interior region and a drain operably coupled to the interior region to remove the ultra-clean liquid from the interior region at a selected rate. A controller 14 is operably coupled to the chamber (200) for selectively controlling the selected rate. In an alternative embodiment, an installation technique (80) for the above cleaning system (1,5) is provided.Type: GrantFiled: July 6, 1998Date of Patent: November 23, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, David C. Wong, Suraj Puri
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Patent number: 5958146Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a hot or heated liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: September 24, 1998Date of Patent: September 28, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, David Wong
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Patent number: 5932027Abstract: A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid having water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas having a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: January 12, 1998Date of Patent: August 3, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 5891256Abstract: A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid including water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas including a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: December 29, 1997Date of Patent: April 6, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 5878760Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: May 22, 1997Date of Patent: March 9, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 5873947Abstract: A technique for cleaning a hard disk using a novel support device 502. The technique includes immersing a disk in a liquid comprising water. The disk has a front face, a back face, an edge, and a center region. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the disk.Type: GrantFiled: August 6, 1997Date of Patent: February 23, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 5868150Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: May 22, 1997Date of Patent: February 9, 1999Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 5849104Abstract: A cleaning system (1, 5) having multiple cleaning chambers (200) is provided. Each cleaning chamber (200) includes an interior region sufficient for immersing a carrier (242), which has at least one wafer disposed therein, into an ultra-clean liquid. The cleaning chamber (200) also has an inlet operably coupled to the interior region to introduce a gas into the interior region and a drain operably coupled to the interior region to remove the ultra-clean liquid from the interior region at a selected rate. A controller 14 is operably coupled to the chamber (200) for selectively controlling the selected rate. In an alternative embodiment, an installation technique (80) for the above cleaning system (1, 5) is provided.Type: GrantFiled: September 19, 1996Date of Patent: December 15, 1998Assignee: YieldUP InternationalInventors: Raj Mohindra, David C. Wong, Suraj Puri
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Patent number: 5772784Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.Type: GrantFiled: November 8, 1995Date of Patent: June 30, 1998Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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Patent number: 5685327Abstract: Apparatus for cleaning and drying a semiconductor wafer. The apparatus includes a vessel adapted to immerse a partially completed semiconductor wafer in a liquid comprising water. The apparatus also includes a control valve operably coupled to the vessel through a drain, and adapted to allow a gaseous mixture to displace the liquid in the vessel, where the liquid is displaced adjacent to the front face of the partially completed wafer. A controller is included. The controller is operably coupled to a plurality of nozzles. The controller can be used to pulse a drying fluid from the plurality of nozzles to the partially completed wafer to remove a possibility of liquid which may be attached to the partially completed wafer.Type: GrantFiled: August 8, 1996Date of Patent: November 11, 1997Assignee: YieldUP InternationalInventors: Raj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Jeffrey Nowell