Patents by Inventor Raj Peddi

Raj Peddi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of repellent material to protect fabrication regions in semi conductor assembly
    Patent number: 9607896
    Abstract: A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: March 28, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Raj Peddi, Jeffrey Gasa, Kenji Kuriyama, Hoseung Yoo
  • Coating adhesives onto dicing before grinding and micro-fabricated wafers
    Patent number: 9082840
    Abstract: A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: July 14, 2015
    Assignee: Henkel IP & Holding GmbH
    Inventors: Hwang Kyu Yun, Jeffrey Leon, Raj Peddi, YounSang Kim
  • COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED WAFERS
    Publication number: 20140242781
    Abstract: A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
    Type: Application
    Filed: May 6, 2014
    Publication date: August 28, 2014
    Inventors: Hwang Kyu Yun, Jeffrey Leon, Raj Peddi, YounSang Kim
  • Coating adhesives onto dicing before grinding and micro-fabricated wafers
    Patent number: 8753959
    Abstract: A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: June 17, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Hwang Kyu Yun, Jeffrey Leon, Raj Peddi, YounSang Kim
  • USE OF REPELLENT MATERIAL TO PROTECT FABRICATION REGIONS IN SEMI CONDUCTOR ASSEMBLY
    Publication number: 20140113435
    Abstract: A method of preparing semiconductor dies from a semiconductor wafer having a plurality of fabrication regions separated by dicing lines on the top side of the wafer, and an adhesive coating on the back side of the wafer, comprises applying a repellent material to the fabrication regions and dicing lines where the adhesive coating is not intended to be printed; applying the adhesive coating to the back side of the wafer; removing the repellent material; and separating the wafer along the dicing lines into individual dies.
    Type: Application
    Filed: January 2, 2014
    Publication date: April 24, 2014
    Applicant: HENKEL US IP LLC
    Inventors: Raj Peddi, Jeffrey Gasa, Kenji Kuriyama, Hoseung Yoo
  • FILM FOR FILLING THROUGH HOLE INTERCONNECTS AND POST PROCESSING FOR INTERCONNECT SUBSTRATES
    Publication number: 20130267089
    Abstract: A method for filling through hole interconnects in a substrate used in the manufacture of electronic devices uses a film filler material. The film comprises a resin matrix filled with conductive and/or dielectric particles, and can be a single or multi-layer film. The method comprises providing a substrate for an electronic device having one or more through hole interconnects; providing a film comprising at least one film filler material for the through hole interconnects; deposing the film filler material over the substrate; and pressing the film filler material into the through hole interconnects.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 10, 2013
    Applicant: HENKEL CORPRATION
    Inventors: Daniel Maslyk, George Carson, Raj Peddi
  • COATING ADHESIVES ONTO DICING BEFORE GRINDING AND MICRO-FABRICATED WAFERS
    Publication number: 20130011999
    Abstract: A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 10, 2013
    Applicant: HENKEL CORPORATION
    Inventors: Hwang Kyu Yun, Jeffrey Leon, Raj Peddi, YounSang Kim
  • METHOD TO REDUCE PLACEMENT VOIDS
    Publication number: 20120261047
    Abstract: A method of applying an adhesive material between two flat substrates to eliminate or reduce placement voids comprises applying an adhesive material on one substrate in a dome shape, contacting the second substrate with the adhesive material in the dome shape, and applying an effective amount of force to bring the two substrates together and push out any entrapped air, thereby disposing the adhesive material between the substrates and eliminating the formation of voids.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 18, 2012
    Inventors: Raj Peddi, Hoseung Yoo, Stephen Aldo Ruatta