Patents by Inventor Raj Pendse

Raj Pendse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Precisely aligned lead frame using registration traces and pads
    Patent number: 5275897
    Abstract: Assemblies of aligned tape automated bonding frames on a substrate, and a method of aligning a tape automated bonding frame to connection sites on the substrate. The method includes photolithographically patterning and etching metal to form a first pattern of signal leads and a second pattern of alignment leads. A semiconductor chip is bonded to the inner lead ends of the first pattern. Metal on a substrate is photolithographically patterned and etched to provide a third pattern of substrate connection sites and a fourth pattern of registration pads. The fourth pattern of registration pads has geometric and dimensional features which precisely correspond to those of the alignment leads. Moreover, the spatial relationship of the third and fourth patterns correspond to the spatial relationship of the first and second patterns. The corresponding geometric and dimensional features of the second and fourth patterns are aligned, whereafter the registration pads and the alignment leads are soldered together.
    Type: Grant
    Filed: May 21, 1992
    Date of Patent: January 4, 1994
    Assignee: Hewlett Packard Company
    Inventors: V. K. Nagesh, Robert Crawford, Raj Pendse
  • Precisely aligned lead frame using registration traces and pads
    Patent number: 5138429
    Abstract: Assemblies of aligned tape automated bonding frames on a substrate, and a method of aligning a tape automated bonding frame to connection sites on the substrate. The method includes photolithographically patterning and etching metal to form a first pattern of signal leads and a second pattern of alignment leads. A semiconductor chip is bonded to the inner lead ends of the first pattern. Metal on a substrate is photolithographically patterned and etched to provide a third pattern of substrate connection sites and a fourth pattern of registration pads. The fourth pattern of registration pads has geometric and dimensional features which precisely correspond to those of the alignment leads. Moreover, the spatial relationship of the third and fourth patterns correspond to the spatial relationship of the first and second patterns. The corresponding geometric and dimensional features of the second and fourth patterns are aligned, whereafter the registration pads and the alignment leads are soldered together.
    Type: Grant
    Filed: August 30, 1990
    Date of Patent: August 11, 1992
    Assignee: Hewlett-Packard Company
    Inventors: V. K. Nagesh, Robert Crawford, Raj Pendse