Patents by Inventor Raja Fazan Gul
Raja Fazan Gul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11950375Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: GrantFiled: April 30, 2021Date of Patent: April 2, 2024Assignee: X Display Company Technology LimitedInventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
-
Patent number: 11897760Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: April 30, 2021Date of Patent: February 13, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Patent number: 11884537Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: March 15, 2021Date of Patent: January 30, 2024Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Patent number: 11834330Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: GrantFiled: October 8, 2020Date of Patent: December 5, 2023Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Publication number: 20230336150Abstract: According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.Type: ApplicationFiled: April 15, 2022Publication date: October 19, 2023Inventors: António José Marques Trindade, Ronald S. Cok, Raja Fazan Gul
-
Publication number: 20230327640Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.Type: ApplicationFiled: March 9, 2023Publication date: October 12, 2023Inventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
-
Publication number: 20230261149Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: António José Marques Trindade, Alexandre Chikhaoui, Ronald S. Cok, Robert R. Rotzoll, Raja Fazan Gul, Lei Liu
-
Patent number: 11626856Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.Type: GrantFiled: August 28, 2020Date of Patent: April 11, 2023Assignee: X-Celeprint LimitedInventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
-
Patent number: 11528808Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: GrantFiled: December 3, 2018Date of Patent: December 13, 2022Assignee: X Display Company Technology LimitedInventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
-
Patent number: 11482979Abstract: A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.Type: GrantFiled: December 3, 2018Date of Patent: October 25, 2022Assignee: X Display Company Technology LimitedInventors: António José Marques Trindade, Raja Fazan Gul, Robert R. Rotzoll, Alexandre Chikhaoui, David Gomez, Ronald S. Cok
-
Patent number: 11398399Abstract: A component source wafer comprises printable components having adhesive disposed on a backside of the printable components. A wafer substrate comprises a sacrificial layer having recessed portions and anchors. A component is disposed entirely over each recessed portion. A tether physically connects each component to at least one of the anchors. A layer of adhesive is disposed on a side of the component adjacent to the recessed portion. Each component is suspended over the wafer substrate and the recessed portion defines a gap separating the component from the wafer substrate.Type: GrantFiled: March 3, 2020Date of Patent: July 26, 2022Assignee: X Display Company Technology LimitedInventors: António José Marques Trindade, Raja Fazan Gul, Ronald S. Cok
-
Publication number: 20220162056Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.Type: ApplicationFiled: January 31, 2022Publication date: May 26, 2022Inventors: Raja Fazan Gul, Ronald S. Cok, Steven Kelleher, António José Marques Trindade, Alin Mihai Fecioru, David Gomez, Christopher Andrew Bower, Salvatore Bonafede, Matthew Alexander Meitl
-
Patent number: 11274035Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.Type: GrantFiled: April 7, 2020Date of Patent: March 15, 2022Assignee: X-Celeprint LimitedInventors: Raja Fazan Gul, Ronald S. Cok, Steven Kelleher, António José Marques Trindade, Alin Mihai Fecioru, David Gomez, Christopher Andrew Bower, Salvatore Bonafede, Matthew Alexander Meitl
-
Publication number: 20210259114Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: ApplicationFiled: April 30, 2021Publication date: August 19, 2021Inventors: David Gomez, Christopher Andrew Bower, Raja Fazan Gul, António José Marques Trindade, Ronald S. Cok
-
Publication number: 20210246017Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: ApplicationFiled: April 29, 2021Publication date: August 12, 2021Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Publication number: 20210246018Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: ApplicationFiled: April 30, 2021Publication date: August 12, 2021Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Publication number: 20210198100Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: ApplicationFiled: March 15, 2021Publication date: July 1, 2021Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Publication number: 20210135649Abstract: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures. A device structure can comprise a device over a sacrificial portion or cavity and a tether with a tether opening extending to the sacrificial portion or cavity. The tether or tether opening can have a T shape. The tether can have a tether length at least one third as large as a device length and the device can have a device length at least twice as large as a device width.Type: ApplicationFiled: August 28, 2020Publication date: May 6, 2021Inventors: António José Marques Trindade, Raja Fazan Gul, Lei Liu, Ronald S. Cok
-
Publication number: 20210061645Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: ApplicationFiled: November 13, 2020Publication date: March 4, 2021Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade
-
Publication number: 20210024349Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.Type: ApplicationFiled: October 8, 2020Publication date: January 28, 2021Inventors: Ronald S. Cok, Raja Fazan Gul, António José Marques Trindade