Patents by Inventor Raja-Sheker Bollampally

Raja-Sheker Bollampally has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-chip bonding method
    Patent number: 6998293
    Abstract: The present invention is generally directed towards a flip chip assembly. In particular a new bonding process for bonding an electronic component to the substrate is disclosed. The method comprises the steps of forming at least one solder pad on the electronic component and forming at least one bond pad on the substrate wherein the at least one bond pad has a top layer formed of a metal. Placing an underfill film on top of the at least one bond pad and heating the electronic component and the substrate. Moving the electronic component towards the substrate such that the at least one solder pad is aligned on top of the at least one bond pad and finally forming a bond between the at least one solder pad and the top layer of the at least one bond pad.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: February 14, 2006
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Achyuta Achari, Mohan R. Paruchuri, Raja-Sheker Bollampally
  • Flip-chip bonding method
    Publication number: 20030183951
    Abstract: The present invention is generally directed towards a flip chip assembly. In particular a new bonding process for bonding an electronic component to the substrate is disclosed. The method comprises the steps of forming at least one solder pad on the electronic component and forming at least one bond pad on the substrate wherein the at least one bond pad has a top layer formed of a metal. Placing an underfill film on top of the at least one bond pad and heating the electronic component and the substrate. Moving the electronic component towards the substrate such that the at least one solder pad is aligned on top of the at least one bond pad and finally forming a bond between the at least one solder pad and the top layer of the at least one bond pad.
    Type: Application
    Filed: March 29, 2002
    Publication date: October 2, 2003
    Inventors: Achyuta Achari, Mohan R. Paruchuri, Raja-Sheker Bollampally