Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.

Abstract: The invention provides novel compounds of formula I: that are monoamine oxidase-B inhibitors, which can be useful in treating obesity, diabetes, and/or cardiometabolic disorders (e.g., hypertension, dyslipidemias, high blood pressure, and insulin resistance).

Abstract: The invention provides novel compounds of formulae I and II: that are monoamine oxidase-B inhibitors, which can be useful in treating obesity, diabetes, and/or cardiometabolic disorders (e.g., hypertension, dyslipidemias, high blood pressure, and insulin resistance).

Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.

Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.

Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.

Abstract: The invention provides a method of treating obesity, diabetes, and/or cardiometabolic disorders (e.g., hypertension, dyslipidemias, high blood pressure, and insulin resistance) in a mammal by administering to the mammal a therapeutically effective amount of an irreversible MAO-B inhibitor.

Abstract: The invention provides novel compounds of formula I: that are monoamine oxidase-B inhibitors, which can be useful in treating obesity, diabetes, and/or cardiometabolic disorders (e.g., hypertension, dyslipidemias, high blood pressure, and insulin resistance).

Abstract: The invention provides novel compounds of formulae I and II: that are monoamine oxidase-B inhibitors, which can be useful in treating obesity, diabetes, and/or cardiometabolic disorders (e.g., hypertension, dyslipidemias, high blood pressure, and insulin resistance).

Abstract: A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.

Abstract: A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.

Abstract: Techniques for utilizing a bonding agent that allows a solder reflow process to occur at a lower reflow temperature. One area of use includes semiconductor device manufacturing processes. The bonding agent is placed between a solder ball and a contact surface. The bonding agent has a melting temperature that is lower than that of the solder ball. Reflow is then performed at a relative low temperature that is high enough for reflowing the bonding agent, yet at the same time, lower than what would be necessary to reflow the solder material. Since, the electrical system is not subjected to the high temperatures necessary for reflowing the solder material, the electronic system experiences less high-temperature related damage.