Patents by Inventor Rajah Prakash

Rajah Prakash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component having boundary element
    Patent number: 10854787
    Abstract: A component having a boundary element is disclosed. In an embodiment a component comprises a semiconductor chip, a housing and a reflective layer, wherein the housing has a shaped body and a base body, the shaped body laterally enclosing the base body at least in places and being different from the reflective layer. In a plan view, the base body has a free area which is uncovered by the shaped body. The free area or a bottom surface of a cavity comprises a mounting surface for the semiconductor chip, wherein the semiconductor chip is arranged on the mounting surface. The bottom surface or the free area is partially covered by the reflective layer, wherein the mounting surface is enclosed at least in regions by a boundary element which adjoins the reflective layer and is configured to prevent the semiconductor chip from being covered by the reflective layer.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: December 1, 2020
    Assignee: OSAM OLED GMBH
    Inventors: Teik Yee Wong, Chee Weng Soong, Rajah Prakash, Christian Betthausen, Chee-Eng Ooi, Ismail Ithnain, Choo Kean Lim, Weng Heng Chan
  • Component Having Boundary Element
    Publication number: 20190044033
    Abstract: A component having a boundary element is disclosed. In an embodiment a component comprises a semiconductor chip, a housing and a reflective layer, wherein the housing has a shaped body and a base body, the shaped body laterally enclosing the base body at least in places and being different from the reflective layer. In a plan view, the base body has a free area which is uncovered by the shaped body. The free area or a bottom surface of a cavity comprises a mounting surface for the semiconductor chip, wherein the semiconductor chip is arranged on the mounting surface. The bottom surface or the free area is partially covered by the reflective layer, wherein the mounting surface is enclosed at least in regions by a boundary element which adjoins the reflective layer and is configured to prevent the semiconductor chip from being covered by the reflective layer.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Inventors: Teik Yee Wong, Chee Weng Soong, Rajah Prakash, Christian Betthausen, Chee-Eng Ooi, Ismail Ithnain, Choo Kean Lim, Weng Heng Chan