Patents by Inventor Rajan B. Vaidyanath

Rajan B. Vaidyanath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140263194
    Abstract: Embodiments of the invention relate to consumables that are used with non-arc deposition processes, including hot-wire deposition processes. Exemplary embodiments of the present invention eliminate the use of arc initiators or arc stabilizers in the consumable. Other embodiments add additional amounts of carbonates in the consumable than would otherwise be present in consumables for arc welding processes. Similarly, other exemplary embodiments of the present invention include additional amounts of nitrides than would otherwise be present in arc process consumables. Other exemplary embodiments include carbides that are desired to be deposited through the non-arc processes.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Lincoln Global, Inc.
    Inventors: Badri K. NARAYANAN, Jonathan S. Ogborn, Michael Whitehead, Rajan B. Vaidyanath