Abstract: A system for forming surface modified substrates includes a laser system, and a laser processing chamber. A laser scanner automatically controls a position of the laser beam or an x-y translating stage upon which the laser processing chamber is mounted thereon for scanning the laser beam relative to a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion, and a coating including metal organic molecules including at least one metal X or particles of metal X on the outer surface. At laser-heated spots atoms of X from the metal coating diffuse into the outer surface to form a modified surface layer including both M and X. The modified surface layer has a thickness of 1 nm, and a 25° C. electrical conductivity ?2.5% above or ?2.5% below a 25° C. electrical conductivity in the bulk portion.

Abstract: A composition of matter includes a substrate material (M) having a bulk portion and an outer surface integrated to the bulk portion. The outer surface includes a modified surface layer. The modified surface layer extends to a depth from the outer surface of at least 1 nm. The modified surface layer includes M and at least one other material (X) which is a metal or metal alloy. The modified surface layer has a 25° C. electrical conductivity which is at least 2.5% above or below a 25° C. electrical conductivity in the bulk portion of M. The composition of matter can be an article that includes a frequency selective surface-based metamaterial, and the plurality of modified surface portions can be a plurality of periodic surface elements that provide a resonant frequency.

Abstract: An imaging device may include an RF source configured to irradiate an object with RF radiation, and an array of RE antenna elements. Each RF antenna element may include a loop bolometer configured to receive the RF radiation after interaction with the object. The imaging device may include a processor configured to generate an image based upon respective outputs from the array of RF antenna elements, and a display coupled to the processor and configured to display the image of the object.

Abstract: An imaging device may include an RF source configured to irradiate an object with RF radiation, and an array of RE antenna elements. Each RF antenna element may include a loop bolometer configured to receive the RF radiation after interaction with the object. The imaging device may include a processor configured to generate an image based upon respective outputs from the array of RF antenna elements, and a display coupled to the processor and configured to display the image of the object.

Abstract: A system for forming surface modified substrates includes a laser system, and a laser processing chamber. A laser scanner automatically controls a position of the laser beam or an x-y translating stage upon which the laser processing chamber is mounted thereon for scanning the laser beam relative to a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion, and a coating including metal organic molecules including at least one metal X or particles of metal X on the outer surface. At laser-heated spots atoms of X from the metal coating diffuse into the outer surface to form a modified surface layer including both M and X. The modified surface layer has a thickness of 1 nm, and a 25° C. electrical conductivity ?2.5% above or ?2.5% below a 25° C. electrical conductivity in the bulk portion.

Abstract: A method of forming surface modified substrates includes providing a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion. A coating is deposited including metal organic molecules including at least one metal X or particles of metal X onto the outer surface. The coating is laser irradiated with a laser beam, where atoms of metal X diffuse into the outer surface to form a modified surface layer including both M and atoms of metal X on the bulk portion. The modified surface layer has a thickness of at least 1 nm, and a 25° C. electrical conductivity that is at least 2.5% above or 2.5% below a 25° C. electrical conductivity in the bulk portion.

Abstract: An MRI compatible medical device includes a non-magnetic metal alloy portion having a bulk portion including a first and a second metal. A surface of the metal alloy portion includes an integral MRI heating resistant surface structure having a thickness ?3 nanometers. The non-magnetic metal alloy portion is structurally different from the bulk portion and includes a lamellar nanostructure or microstructure. The MRI heating resistant surface structure can include (i) a matrix phase including the first and second metal having nanometer or micron scale particles, precipitates and/or inclusions that differ in chemical composition and physical characteristics of the matrix phase and are discontinuously distributed therein; (ii) a level of crystallinity at least 5% less than the bulk portion; and/or (iii) metal atoms different from the first and second metal having a concentration profile evidencing diffusion into the metal alloy portion.

Abstract: A method of forming surface modified substrates includes providing a substrate of material (M) having a bulk portion and an outer surface integrated with the bulk portion. A coating is deposited including metal organic molecules including at least one metal X or particles of metal X onto the outer surface. The coating is laser irradiated with a laser beam, where atoms of metal X diffuse into the outer surface to form a modified surface layer including both M and atoms of metal X on the bulk portion. The modified surface layer has a thickness of at least 1 nm, and a 25° C. electrical conductivity that is at least 2.5% above or 2.5% below a 25° C. electrical conductivity in the bulk portion.

Abstract: An MRI compatible medical device includes a non-magnetic metal alloy portion including a first and at least a second metal. A surface of the metal alloy portion includes an integral MRI heating resistant surface structure having a thickness?3 nanometers. The MRI heating resistant surface structure includes one or more of (i) a matrix phase including the first and second metal having a plurality of nanometer or micron scale particles, precipitates and/or inclusions constituting a volume fraction?3%, wherein the particles, precipitates or inclusions differ in chemical composition and physical characteristics of the matrix phase and are discontinuously distributed therein; (ii) a level of crystallinity at least 5% less as compared to a level of crystallinity in the bulk of the metal alloy portion; (iii) one or more metal atoms different from the first and second metal having a concentration profile evidencing diffusion into the metal alloy portion.

Abstract: A composition of matter includes a substrate material (M) having a bulk portion and an outer surface integrated to the bulk portion. The outer surface includes a modified surface layer. The modified surface layer extends to a depth from the outer surface of at least 1 nm. The modified surface layer includes M and at least one other material (X) which is a metal or metal alloy. The modified surface layer has a 25° C. electrical conductivity which is at least 2.5% above or below a 25° C. electrical conductivity in the bulk portion of M. The composition of matter can be an article that includes a frequency selective surface-based metamaterial, and the plurality of modified surface portions can be a plurality of periodic surface elements that provide a resonant frequency.

Abstract: SM-based actuators (110) and release mechanisms (100) therefrom and systems (500) including one or more release mechanisms (100). The actuators (110) comprise a SM member (118) and a deformable member (140) mechanically coupled to the SM member (118) which deforms upon a shape change of the SM member triggered by a phase transition of the SM member. A retaining element (160) is mechanically coupled to the deformable member (140), wherein the retaining element (160) moves upon the shape change. Release mechanism (100) include an actuator, a rotatable mechanism (120) including at least one restraining feature (178) for restraining rotational movement of the retaining element (160) before the shape change, and at least one spring (315) that provides at least one locked spring-loaded position when the retaining element is in the restraining feature and at least one released position that is reached when the retaining element is in a position beyond the restraining feature (178).

Abstract: SM-based actuators (110) and release mechanisms (100) therefrom and systems (500) including one or more release mechanisms (100). The actuators (110) comprise a SM member (118) and a deformable member (140) mechanically coupled to the SM member (118) which deforms upon a shape change of the SM member triggered by a phase transition of the SM member. A retaining element (160) is mechanically coupled to the deformable member (140), wherein the retaining element (160) moves upon the shape change. Release mechanism (100) include an actuator, a rotatable mechanism (120) including at least one restraining feature (178) for restraining rotational movement of the retaining element (160) before the shape change, and at least one spring (315) that provides at least one locked spring-loaded position when the retaining element is in the restraining feature and at least one released position that is reached when the retaining element is in a position beyond the restraining feature (178).

Abstract: A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A movable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member for thermally coupling the first member to the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 K, a transformation range <40 K, and a hysteresis of <10 K. A bias spring is between the first member and the second member. At the phase change the switch provides a distance change (displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.

Abstract: A thermal conduction switch includes a thermally-conductive first member having a first thermal contacting structure for securing the first member as a stationary member to a thermally regulated body or a body requiring thermal regulation. A movable thermally-conductive second member has a second thermal contacting surface. A thermally conductive coupler is interposed between the first member and the second member for thermally coupling the first member to the second member. At least one control spring is coupled between the first member and the second member. The control spring includes a NiTiFe comprising shape memory (SM) material that provides a phase change temperature <273 K, a transformation range <40 K, and a hysteresis of <10 K. A bias spring is between the first member and the second member. At the phase change the switch provides a distance change (displacement) between first and second member by at least 1 mm, such as 2 to 4 mm.