Patents by Inventor Rajat K. Agarwal

Rajat K. Agarwal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030018095
    Abstract: The use of an adduct of an isocyanate resin and an isocyanate-reactive liquid or semi-solid epoxy resin in an expandable thermosettable composition helps to reduce the tackiness of the composition and also increases its dimensional stability, as compared to compositions in which only non-adducted liquid or semi-solid epoxy resins are present
    Type: Application
    Filed: April 27, 2001
    Publication date: January 23, 2003
    Inventor: Rajat K. Agarwal
  • Publication number: 20020192387
    Abstract: The resistance of a composite containing a metal carrier and an expanded thermoset resin to adhesive failure may be enhanced by phosphating the surface of the metal carrier to provide a phosphate conversion coating prior to forming the composite.
    Type: Application
    Filed: June 4, 2001
    Publication date: December 19, 2002
    Inventors: Rajat K. Agarwal, Scott J. Beleck
  • Publication number: 20020102356
    Abstract: The anticorrosive properties of a coating autodeposited on a metal substrate are improved by contacting the autodeposited coating with an aqueous solution containing Group IIA or Group IIB metal cations (e.g., calcium or zinc cations) and phosphate anions prior to curing. The rinse solution is preferably acidic and can be prepared, for example, from calcium nitrate and an oxy acid of phosphorus or zinc dihydrogen phosphate. Optionally, the rinse solution also includes an accelerator such as hydroxylamine.
    Type: Application
    Filed: November 21, 2001
    Publication date: August 1, 2002
    Inventors: Rajat K. Agarwal, Douglas Brown, William E. Fristad, Graham E. Butcher, Zafar Iqbal
  • Publication number: 20020011309
    Abstract: A film of a polymer or polymer precursor such as an epoxy resin is autodeposited on an active metal surface and then used to form an adhesive bond directly between the metal surface and the surface of a rubber substrate. Excellent adhesion of the metal to the rubber is obtained without the need to either phosphate the metal surface or use a primer or adhesive other than the autodeposited coating.
    Type: Application
    Filed: February 20, 2001
    Publication date: January 31, 2002
    Inventors: Rajat K. Agarwal, William E. Fristad, Gregg W. Rossier, Roman M. Skikun