Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.

Abstract: A system includes a computer processor including N cores; and a plurality of device aging sensors, wherein each one of the plurality of device aging sensors is disposed within a respective core, the plurality of device aging sensors being configured to communicate core aging information with a core scheduler in the computer processor, wherein the core scheduler is configured to make a first set of M cores available to a thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a first time period in which the core aging information indicates that aging of the first set of M cores is below a threshold, and wherein the core scheduler is configured to make a second set of M cores available to the thread scheduler and remaining cores of the N cores unavailable to the thread scheduler in a second time period.

Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.

Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

Abstract: The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.

Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

Abstract: A mobile device includes an exterior housing, a display, a capacitive sensor, a temperature sensor, and a controller. The capacitive sensor is coupled to the exterior housing at a backside of the mobile device and the temperature sensor is coupled to one or more components of the mobile device. The controller is coupled to the capacitive sensor and to the temperature sensor. The controller is configured to adjust a temperature threshold of the mobile device in response to detecting the presence of a case installed on the exterior housing. The controller is also configured to adjust one or more operating parameters of the mobile device to control a temperature of the exterior housing to below the temperature threshold based on the output of the capacitive sensor and one or more readings of the temperature sensor.

Abstract: An apparatus includes a first circuit and a second circuit sharing an instruction stream. A voltage controller circuit is configured to provide an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream. In another aspect, a method of operating a power management function is presented. The method includes providing an instruction stream for a first circuit and a second circuit and providing selectively an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream.

Abstract: A method includes: acquiring temperature values from a plurality of temperature sensors spatially distributed within a device; using the temperature values, calculating skin temperature values corresponding to each of the temperature sensors; comparing the skin temperature values to a first temperature threshold; in response to determining that at least one of the skin temperature values exceeds the first temperature threshold, measuring temperature over time; comparing the temperature over time to a second temperature threshold; and in response to determining that the temperature over time exceeds the second temperature threshold, reducing power consumption of the device.

Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

Abstract: A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

Abstract: An embodiment in accordance with the present invention provides a method for non-invasively determining the functional severity of coronary artery stenosis. The method includes gathering patient-specific data related to concentration of a contrast agent within a coronary artery of a patient using a coronary computed tomography angiography scan (CCTA). The patient-specific data is used to calculate a patient-specific transluminal attenuation gradient for the coronary artery of the patient. The patient specific transluminal attenuation gradient is used to determine an estimate of a coronary flow velocity, pressure gradient, loss coefficient, coronary flow reserve, and/or fractional flow reserve for the patient. Coronary flow velocity, pressure gradient, loss coefficient, coronary flow reserve, and fractional flow reserve can then be used to estimate the functional severity of coronary artery stenosis.

Abstract: In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.

Abstract: A method and an apparatus for providing thermal solution are provided. The apparatus includes an electronic component that emits heat during the operation of the apparatus. A single-piece component covers the electronic component and is configured to shield the electronic component from an electromagnetic field surrounding the electronic component. The single-piece component is also configured to transfer at least a portion of the heat emitted by the electronic component to a cooling region of the apparatus. In another aspect, a method and an apparatus for providing thermal solution are provided. The apparatus shields an electronic component of the apparatus from an electromagnetic field surrounding the electronic component. The apparatus transfers at least a portion of heat emitted by the electronic component to a cooling region of the mobile device. The shielding and the transferring are performed by the same single-piece component of the apparatus.

Abstract: A thermal controller for managing thermal energy of a multi-core processor is provided. The cores include a first core processing a load and remaining cores. The thermal controller is configured to determine that a temperature of the first core is greater than a first threshold, determine a temperature of a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold, and determine whether the temperature of the second core is greater than or less than a second threshold. The thermal controller is configured to transfer at least a portion of the load of the first core to the second core in response to determining that the temperature of the first core is greater than the first threshold and based on whether the temperature of the second core is greater than or less than the second threshold.

Abstract: A heat transfer component of a smart watch captures at least a portion of heat emitted by one or more electronic components located within an enclosure of the smart watch. The heat transfer component transfers at least a portion of the captured heat to a wrist band outside the enclosure of the smart watch. The wrist band allows for dissipation of at least a portion of the transferred heat through at least one surface of the wrist band.

Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.

Abstract: A performance setting technique is disclosed for a clocked circuit such as a processor in an integrated circuit. The technique determines a maximum power consumption for the clocked circuit as a function of a total thermal resistance of a mobile device incorporating the integrated circuit. The total thermal resistance is a sum of a system thermal resistance for the mobile device and a device thermal resistance for the integrated circuit.