Patents by Inventor Rajeev Kulkami

Rajeev Kulkami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8318076
    Abstract: There are provided method and apparatus for the forming of three-dimensional objects in a layered fashion, wherein improvements are made to the support structure to improve the quality of the resulting three-dimensional objects. The support structure may include encapsulation along the interface boundary of the support-object interface to prevent or reduce the likelihood of separation of the build material, that forms the three-dimensional object, from the support material, that forms the support structure, or vice versa. The support structure may also or alternatively include both a porous support structure and a solid support structure to prevent or reduce the likelihood of separation of the support structure from the build platform and to improve the quality of the down-facing surfaces of the three-dimensional object. Methods are also provided for selectively depositing the support material and build material and for encapsulating the interface boundary with support material.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: November 27, 2012
    Assignee: 3D Systems, Inc.
    Inventors: Hongqing Vincent Wang, Pavan Kumar, John Stockwell, Khalil Moussa, Rajeev Kulkami
  • Publication number: 20110304074
    Abstract: There are provided method and apparatus for the forming of three-dimensional objects in a layered fashion, wherein improvements are made to the support structure to improve the quality of the resulting three-dimensional objects. The support structure may include encapsulation along the interface boundary of the support-object interface to prevent or reduce the likelihood of separation of the build material, that forms the three-dimensional object, from the support material, that forms the support structure, or vice versa. The support structure may also or alternatively include both a porous support structure and a solid support structure to prevent or reduce the likelihood of, separation of the support structure from the build platform and to improve the quality of the down-facing surfaces of the three-dimensional object. Methods are also provided for selectively depositing the support material and build material and for encapsulating the interface boundary with support material.
    Type: Application
    Filed: June 15, 2010
    Publication date: December 15, 2011
    Applicant: 3D Systems Inc.
    Inventors: Hongqing Vincent Wang, Pavan Kumar, John Stockwell, Khalil Moussa, Rajeev Kulkami