Patents by Inventor Rajeev Lakra

Rajeev Lakra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040093583
    Abstract: A project bidding system includes a modular bidding toolkit for facilitating bid solicitation and evaluation. The toolkit provides a bid template for specifying bidding parameters for a project, a terms and conditions document, a provider engagement letter, and a provider policy. The bid template may allow association of a project with a first number of work hours and a first billing rate for a first provider level, and with a second number of work hours and a second billing rate for a second provider level, and reception of a plurality of bids for the project from the plurality of potential bidders, one or more of the plurality of bids including a third billing rate for the first provider level and a fourth billing rate for the second provider level.
    Type: Application
    Filed: November 13, 2002
    Publication date: May 13, 2004
    Inventors: Brian T. McAnaney, Joseph J. Ringhoffer, Rajeev Lakra