Abstract: A method for monitoring operation or status of an electrical submersible pump (ESP) is provided, which includes a) collecting historical time-series data related to ESP operation: b) extracting historical time-series data related to healthy ESP operation from the historical time-series data of a): c) extracting feature data from the historical time-series data extracted in b); d) extracting or calculating values of at least one key performance indicator (KPI) related to healthy ESP operation from the historical times-series data extracted in b): c) using the feature data of c) and the values of at least one KPI of d) to train a machine learning (ML) model to predict at least one target KPI related to healthy ESP operation given feature data as input; and f) using the ML model trained in c) to monitor operation or status of the ESP. Other aspects are described and claimed.

Abstract: A method can include receiving real-time, time series data from equipment at a wellsite that includes a wellbore in contact with a fluid reservoir; processing the time series data as input to a trained machine learning model to predict a future solids event related to influx of solids into the wellbore from the fluid reservoir; and outputting a time of the future solids event.

Abstract: An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the circuit card. First and second side panels extending substantially perpendicularly from opposing ends of the major panel to form a bracket. A depth of the bracket is suitable for receiving the circuit card and a heatsink positioned in close contact with the integrated circuit. When the circuit card and the heatsink are suitably received within the air duct cover, the air duct cover and the printed circuit board define an air duct within which the heatsink resides. The spring is attached to an interior surface of the major panel.