Patents by Inventor Rajeev Ranjan

Rajeev Ranjan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040165530
    Abstract: A communication system that includes multiple nodes controls a flow of data from a first node of the multiple nodes to a second node of the multiple nodes without relying on an estimate of a rate at which data is drawn from a buffer of the second node and such that an overflow and an underflow of the buffer is avoided. The second node determines multiple flow control parameters, including a current occupancy (Q) of the buffer and an upper threshold (U) and a lower threshold (L) for an occupancy of the buffer and determines a desired data rate (r) based on the multiple flow control parameters. The desired data rate can be used to adjust a data rate for the flow of data. In another embodiment, the communication system further dynamically controls a rate at which flow control messages are conveyed by the second node to the first node.
    Type: Application
    Filed: February 25, 2003
    Publication date: August 26, 2004
    Inventors: Anand S. Bedekar, Rajeev Agrawal, Rajeev Ranjan
  • Patent number: 6660696
    Abstract: Phosphorothionate derivatives derived from cashew nut shell liquid (CNSL) for use as an thermally stable antioxidant, antiwear, friction reducing and extreme pressure additive in a lubricant composition are synthesized by the steps of (a) partially hydrogenating distilled technical cashew nut shell liquid with palladium or nickel or platinum catalyst; to hydrogenate the olefinic chain; (b) reacting partially hydrogenated technical cashew nut shell liquid with phosphorus trihalide and sulphur, the reaction being carried out at a temperature ranging from 20 to 220° C. A lubricant containing a major proportion of a material selected from the group consisting of an oil of lubricating viscosity or a grease; and remainder an additive including CNSL phosphorothionate derivative, prepared by the foregoing process.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: December 9, 2003
    Assignee: Indian Oil Corporation Limited
    Inventors: Rajeev Ranjan, Ajay Kumar Arora, Rakesh Sarin, Deepak Kumar Tuli, Ram Prakash Verma, Akhilesh Kumar Bhatnagar
  • Publication number: 20020199019
    Abstract: A communication system distributes the functions of a socket abstraction layer of the prior art between a socket abstraction layer included in an client communication device, such as a mobile subscriber, and a socket abstraction layer in a an agent communication device, such as an infrastructure serving the mobile subscriber. By so distributing the functions of the socket abstraction layer, headers may be reduced in signaling between the client communication device and the corresponding agent communication device as part of call set ups and tear downs and in the exchange of payloads between the client and agent communication devices. By reducing the required headers, overhead is reduced and bandwidth is conserved in communications between the client and agent communication devices, such as in over-the-air communications between a mobile subscriber and an infrastructure serving the mobile subscriber, with resulting increases in system capacity and improvements in system efficiency.
    Type: Application
    Filed: June 22, 2001
    Publication date: December 26, 2002
    Inventors: Robert D. Battin, Rajeev Ranjan, Stephen L. Spear
  • Patent number: 5910884
    Abstract: An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the circuit card. First and second side panels extending substantially perpendicularly from opposing ends of the major panel to form a bracket. A depth of the bracket is suitable for receiving the circuit card and a heatsink positioned in close contact with the integrated circuit. When the circuit card and the heatsink are suitably received within the air duct cover, the air duct cover and the printed circuit board define an air duct within which the heatsink resides. The spring is attached to an interior surface of the major panel.
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: June 8, 1999
    Assignee: International Business Machines Corporation
    Inventors: Jose Arturo Garza, Dales Morrison Kent, Ciro Neal Ramirez, Rajeev Ranjan Sinha