Patents by Inventor Rajen Dias

Rajen Dias has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Variable depth microchannels
    Publication number: 20080073061
    Abstract: A channel heat exchanger and cooling system with plan-wise variable rate of cooling that corresponds, in part, to a plan-wise variable heat flux and a method of manufacturing and using same.
    Type: Application
    Filed: September 27, 2006
    Publication date: March 27, 2008
    Inventors: Rajen Dias, Lars Skoglund
  • THERMAL INTERFACE APPARATUS, SYSTEMS, AND FABRICATION METHODS
    Publication number: 20080005886
    Abstract: A method and machine may operate to fabricate a unitary, substantially uniformly distributed transfer material that can be coupled to a carrier material.
    Type: Application
    Filed: September 18, 2007
    Publication date: January 10, 2008
    Inventors: Rajen Dias, Yongmei Liu
  • Microelectronic device interconnects
    Patent number: 7314817
    Abstract: A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: January 1, 2008
    Assignee: Intel Corporation
    Inventors: Rajen Dias, Biju Chandran
  • Microelectronic device interconnects
    Patent number: 7078822
    Abstract: A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: July 18, 2006
    Assignee: Intel Corporation
    Inventors: Rajen Dias, Biju Chandran
  • Thermal interface apparatus, systems, and fabrication methods
    Publication number: 20060146501
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.
    Type: Application
    Filed: March 6, 2006
    Publication date: July 6, 2006
    Inventors: Rajen Dias, Yongmei Liu
  • Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
    Patent number: 7064014
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: June 20, 2006
    Assignee: Intel Corporation
    Inventors: Rajen Dias, Biju Chandran
  • Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
    Patent number: 6955947
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a beveled sidewall and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the beveled sidewall.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: October 18, 2005
    Assignee: Intel Corporation
    Inventors: Rajen Dias, Biju Chandran
  • Microelectronic device interconnects
    Publication number: 20050208280
    Abstract: A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.
    Type: Application
    Filed: May 16, 2005
    Publication date: September 22, 2005
    Inventors: Rajen Dias, Biju Chandran
  • Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
    Publication number: 20050040498
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a beveled sidewall and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the beveled sidewall.
    Type: Application
    Filed: September 14, 2004
    Publication date: February 24, 2005
    Inventors: Rajen Dias, Biju Chandran
  • Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same
    Publication number: 20050017371
    Abstract: The invention provides an electronic assembly comprising a carrier substrate, a die, and a solidified underfill material. The carrier substrate has an upper plane. The die has a die substrate and an integrated circuit formed on one side of the die substrate. The die has a lower major surface over the upper plane, an upper major surface, and a plurality of side edge surfaces from the upper major surface to the lower major surface. A corner edge portion where extensions of two of the side edge surfaces meet has been removed. The solidified underfill material is located between and contacts both the upper plane of the carrier substrate and the lower surface of the die.
    Type: Application
    Filed: July 22, 2003
    Publication date: January 27, 2005
    Inventors: Zhiyong Wang, Song-Hua Shi, Lars Skoglund, Rajen Dias
  • Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
    Publication number: 20050012205
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.
    Type: Application
    Filed: August 10, 2004
    Publication date: January 20, 2005
    Inventors: Rajen Dias, Biju Chandran
  • Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
    Patent number: 6812548
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: November 2, 2004
    Assignee: Intel Corporation
    Inventors: Rajen Dias, Biju Chandran
  • Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
    Patent number: 6790709
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a beveled sidewall and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the beveled sidewall.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: September 14, 2004
    Assignee: Intel Corporation
    Inventors: Rajen Dias, Biju Chandran
  • Microelectronic device interconnects
    Publication number: 20030234277
    Abstract: A microelectronic assembly including a plurality of conductive columns extending from a bond pad of a microelectronic device and a conductive adhesive on a land pad of a carrier substrate electrically attached to the conductive columns.
    Type: Application
    Filed: June 25, 2002
    Publication date: December 25, 2003
    Inventors: Rajen Dias, Biju Chandran
  • Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
    Publication number: 20030102526
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 5, 2003
    Inventors: Rajen Dias, Biju Chandran
  • Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
    Publication number: 20030104679
    Abstract: A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a beveled sidewall and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the beveled sidewall.
    Type: Application
    Filed: November 30, 2001
    Publication date: June 5, 2003
    Inventors: Rajen Dias, Biju Chandran