Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

Abstract: A method for producing a computationally efficient system that reduces the number of iterations required to generate a conductivity image pattern of a subsurface object, and its attendant conductivity distribution, through a solution to the system of field equations that simultaneously satisfies all of the boundary conditions and conserves internal current flux densities.

Abstract: A method for producing a computationally efficient system that reduces the number of iterations required to generate a conductivity image pattern of a subsurface object, and its attendant conductivity distribution, through a solution to the system of field equations that simultaneously satisfies all of the boundary conditions and conserves internal current flux densities.

Abstract: A method of imaging an object contained in a medium, having a specific impedance which is different from the specific impedance of the medium, comprising applying current to the medium at various locations at a surface of the medium, extracting current at other locations, detecting voltages produced by the current which has passed through the medium from the surface of the medium at various other locations, successively determining a location and shape and conductivity of the object with increasing accuracy by processing values of the detected voltages, determining a region in the medium in which the object is located from values of the detected voltages which are within upper and lower threshold values, applying acceleration procedures to the conductivities within the region in the course of iterative refinement of these values in the course of an imaging procedure, subsequently restricting further determination of the location of the object with increasing accuracy to voltages obtained from the region of th

Abstract: A method of imaging an object contained in a medium, having a specific impedance which is different from the specific impedance of the medium, comprising applying current to the medium at various locations at a surface of the medium, extracting current at other locations, detecting voltages produced by the current which has passed through the medium from the surface of the medium at various other locations, successively determining a location and shape and conductivity of the object with increasing accuracy by processing values of the detected voltages, determining a region in the medium in which the object is located from values of the detected voltages which are within upper and lower threshold values, applying acceleration procedures to the conductivities within the region in the course of iterative refinement of these values in the course of an imaging procedure, subsequently restricting further determination of the location of the object with increasing accuracy to voltages obtained from the region of th

Abstract: The HDEIT method of the present invention permits one to use a variety of such indices to distinguish a tumour from normal surrounding tissue because it produces the value of the tissue characteristic at each zone in the tissues measured in accordance with the applied frequency. The tumour distinguishing analysis may be applied to the HDEIT image, or may be applied to the data that comprise the image without generating the image. Such methods are intended to permit the detection of tumors that are too small to be accurately seen in an image, but produce a large enough index for diagnostic purposes. One can apply this capability of the HDEIT method in a number of ways. For example, one can quickly scan the breast at low resolution, perform a distinguishing analysis for tumors, and then only perform a longer-duration high resolution scan if there was an indication of a diagnostically significant area to be examined.