Abstract: Disclosed herein is an LED device that includes a display package and a plurality of LED dies arranged on a top surface of the display package. The display package includes a molding compound, a backplane die, and at least one spacer structure, with the backplane die and the at least one spacer structure being embedded within the molding compound. In some embodiments, the plurality of LED dies includes a first die containing red LEDs, a second die containing green LEDs, and a third die containing blue LEDs. The backplane die includes driver circuits configured to drive LEDs in the plurality of LED dies, for example, LEDs of the first die, the second die, and the third die. The at least one spacer structure has a higher thermal conductivity than the molding compound and is configured to dissipate heat generated by the LEDs in the plurality of LED dies.

Abstract: Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificial reality images.

Abstract: In some examples, an article comprises a semiconductor including at least one integrated circuit and an inorganic semiconductor layer bonded to a first surface of the semiconductor. The inorganic semiconductor layer comprises a ?LED array, and the first surface of the semiconductor extends beyond a first edge of the inorganic semiconductor layer. The first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the first surface of the semiconductor.

Abstract: Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs and apparatuses formed using the disclosed techniques. According to certain embodiments, a display projector includes a display device and a collimator assembly. The display device includes a backplane including a first plurality of features. The display device further includes a plurality of dies. Each die of the plurality of dies comprises a plurality of light emitting diodes and is bonded to the backplane. The collimator assembly includes a plurality of lenses and a second plurality of features. The collimator assembly is attached to the display device through coupling the first plurality of features with the second plurality of features such that the plurality of dies are aligned with the plurality of lenses.

Abstract: Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificial reality images.

Abstract: Disclosed herein are display systems with multiple display packages. In some examples, a first display package includes a first LED die and a first backplane die. The first LED die includes a wire interface that is symmetric about a first plane. The first backplane die includes input/output (I/O) pads that are electrically connected to the wire interface and symmetric about a second plane, perpendicular to the first plane. A similarly configured second display package includes a second LED die with a wire interface identical in layout to that of the first LED die, and a second backplane die with I/O pads identical in layout to that of the first backplane die. The second LED die can be positioned with respect to the second backplane die as a mirror reflection across the second plane of the position of the first LED die with respect to the first backplane die.

Abstract: Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificial reality images.

Abstract: An IC chip includes I/O bumps on a back side, a first die, a second die, a first circuit, and a second circuit. The first die has driver circuits for LED devices, the LED devices being located on a front-facing surface of the first die. The first circuit extends from the front side toward the back side and across a thickness of the first die. The first circuit provides electrical connections between the LED devices and at least some of the I/O bumps. The first die and the second die can be stacked vertically or arranged laterally adjacent. The second circuit extends between the first die and the second die to electrically connect the first die and the second die. A circuit board can be electrically connected to the IC chip through the I/O bumps to, among other things, provide power to the various components of the IC chip.

Abstract: A camera module includes an image sensor, a lens assembly, a printed circuit board, and a substrate. The image sensor has edges that define a two-dimensional footprint substantially parallel to a surface of the image sensor. The lens assembly is coupled to a top surface of the image sensor and focuses light onto the top surface of the image sensor. Edges of the lens assembly do not extend beyond the footprint. The printed circuit board is below the image sensor and controls the image sensor. The substrate is coupled to a bottom surface of the image sensor and to a top surface of the printed circuit board. The substrate electrically couples the image sensor to the printed circuit board. Edges of the substrate do not extend beyond the footprint.

Abstract: Disclosed herein are display devices having a left projector and a right projector. According to certain embodiments, a display device includes a first display package having a first LED die, a second LED die, a third LED die, and a first backplane die that is electrically connected to the first LED die, the second LED die, and the third LED die. Each of the first LED die, the second LED die, and the third LED die is symmetric about a first plane that is parallel to an emission direction of the first LED die and perpendicular to a longitudinal direction of the first LED die. The first backplane die is symmetric about a second plane that is parallel to the emission direction of the first LED die and parallel to the longitudinal direction of the first LED die.

Abstract: An article including a semiconductor die including integrated circuitry is described. The semiconductor die defines a first major surface, a second major surface opposite the first major surface, and a plurality of perimeter walls joining the first major surface and the second major surface. The article further includes at least one through silicon via extending through the semiconductor die between the first major surface and the second major surface and a fill material surrounding at least part of the semiconductor die. The fill material contacts at least one of the plurality of perimeter walls, and a surface of the fill material is substantially co-planar with the first major surface of the semiconductor die. The article further includes at least one redistribution layer on the first major surface of the semiconductor die and the surface of the fill material.

Abstract: Disclosed herein is an LED device that includes a display package and a plurality of LED dies arranged on a top surface of the display package. The display package includes a molding compound, a backplane die, and at least one spacer structure, with the backplane die and the at least one spacer structure being embedded within the molding compound. In some embodiments, the plurality of LED dies includes a first die containing red LEDs, a second die containing green LEDs, and a third die containing blue LEDs. The backplane die includes driver circuits configured to drive LEDs in the plurality of LED dies, for example, LEDs of the first die, the second die, and the third die. The at least one spacer structure has a higher thermal conductivity than the molding compound and is configured to dissipate heat generated by the LEDs in the plurality of LED dies.

Abstract: Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs and apparatuses formed using the disclosed techniques. According to certain embodiments, a display projector includes a display device and a collimator assembly. The display device includes a backplane including a first plurality of features. The display device further includes a plurality of dies. Each die of the plurality of dies comprises a plurality of light emitting diodes and is bonded to the backplane. The collimator assembly includes a plurality of lenses and a second plurality of features. The collimator assembly is attached to the display device through coupling the first plurality of features with the second plurality of features such that the plurality of dies are aligned with the plurality of lenses.

Abstract: Disclosed herein are techniques for managing the thermal resistance and the planarity of a display package. According to certain embodiments, a device includes a display package having a molding compound; a plurality of light emitting diode (LED) dies arranged on a top surface of the display package, wherein each LED die of the plurality of LED dies includes a plurality of LEDs; a backplane die embedded within the molding compound of the display package, wherein the backplane die is electrically coupled to each LED die of the plurality of LED dies; and at least one spacer structure embedded within the molding compound of the display package. The backplane die and the at least one spacer structure together provide mechanical support and planar alignment for the plurality of LED dies arranged on the top surface of the display package. The at least one spacer structure has a first thermal conductivity, and the molding compound has a second thermal conductivity lower than the first thermal conductivity.

Abstract: Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs. According to certain embodiments, a method includes using lithography to form a first plurality of contact pads and a second plurality of contact pads on a backplane; bonding a plurality of dies to the first plurality of contact pads, wherein each of the plurality of dies comprises a plurality of light emitting diodes; forming a first plurality of features on the second plurality of contact pads; and aligning a plurality of lenses on an assembly with the plurality of dies by coupling a second plurality of features on the assembly with the first plurality of features on the second plurality of contact pads.

Abstract: A semiconductor device has a plurality of first semiconductor die with an encapsulant deposited over a first surface of the first semiconductor die and around the first semiconductor die. An insulating layer is formed over the encapsulant and over a second surface of the first semiconductor die opposite the first surface. The insulating layer includes openings over the first semiconductor die. A first conductive layer is formed over the first semiconductor die within the openings. A second conductive layer is formed over the first conductive layer to form vertical conductive vias. A second semiconductor die is disposed over the first semiconductor die and electrically connected to the first conductive layer. A bump is formed over the second conductive layer outside a footprint of the first semiconductor die. The second semiconductor die is disposed over an active surface or a back surface of the first semiconductor die.

Abstract: Three-dimensional integrated circuit component(s) are described including a System-on-a-Chip (SoC) die and a separate static random-access memory (SRAM) subcomponent in a vertically stacked arrangement. Such stacked SoC/SRAM integrated circuit components may form part of a system to render artificial reality images.

Abstract: An IC chip includes I/O bumps on a back side, a first die, a second die, a first circuit, and a second circuit. The first die has driver circuits for LED devices, the LED devices being located on a front-facing surface of the first die. The first circuit extends from the front side toward the back side and across a thickness of the first die. The first circuit provides electrical connections between the LED devices and at least some of the I/O bumps. The first die and the second die can be stacked vertically or arranged laterally adjacent. The second circuit extends between the first die and the second die to electrically connect the first die and the second die. A circuit board can be electrically connected to the IC chip through the I/O bumps to, among other things, provide power to the various components of the IC chip.

Abstract: In some examples, an article comprises a semiconductor including at least one integrated circuit and an inorganic semiconductor layer bonded to a first surface of the semiconductor. The inorganic semiconductor layer comprises a ?LED array, and the first surface of the semiconductor extends beyond a first edge of the inorganic semiconductor layer. The first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the first surface of the semiconductor.

Abstract: In some examples, an article comprises a semiconductor including at least one integrated circuit, a ?LED array on a first surface of the semiconductor, and a fill material disposed on a first edge of the semiconductor. The first edge of the ?LED array or the semiconductor is oriented substantially perpendicular to the first surface of the semiconductor.