Patents by Inventor Rajesh Bajaj

Rajesh Bajaj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069926
    Abstract: Provisioning business functions is provided. A runtime binary activation code is sent to a nodal edge server that has a needed runtime binary for a set of edge devices to perform a business function. A secure shell protocol connection with root operating system access is established to the nodal edge server that has the needed runtime binary to execute the runtime binary activation code.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Harish Bharti, Rajesh Kumar Saxena, Sandeep Sukhija, Deepak Bajaj
  • Publication number: 20240073799
    Abstract: Setting a primary server within a business density cluster when the business density location changes. A new primary edge provisioning server replaces a current primary edge provisioning server when the business density cluster is determined not to include the current primary edge provisioning server. An edge provisioning framework handles the associations and dissociations of the edge network(s) to build the new primary server within the business density cluster. The former primary server is respawned as a new secondary node to the new primary server.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Rajesh Kumar Saxena, Harish Bharti, Deepak Bajaj, Sandeep Sukhija
  • Patent number: 8362613
    Abstract: The present disclosure is directed to a semiconductor die having a chip outline boundary, a die seal, a row of input/output contact pads separated from the chip outline boundary by the die seal, a first row of solder bump connections positioned between the row of input/output contact pads and the die seal, and a second row of solder bump connections separated from the first row of solder bump connections by the row of input/output contact pads.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 29, 2013
    Assignee: STMicroelectronics Pvt Ltd.
    Inventors: Anil Yadav, Sanjeev Kumar Jain, Rajesh Bajaj
  • Publication number: 20120168934
    Abstract: The present disclosure is directed to a semiconductor die having a chip outline boundary, a die seal, a row of input/output contact pads separated from the chip outline boundary by the die seal, a first row of solder bump connections positioned between the row of input/output contact pads and the die seal, and a second row of solder bump connections separated from the first row of solder bump connections by the row of input/output contact pads.
    Type: Application
    Filed: December 30, 2010
    Publication date: July 5, 2012
    Applicant: STMicroelectronics Pvt Ltd.
    Inventors: Anil Yadav, Sanjeev Kumar Jain, Rajesh Bajaj
  • Patent number: 6888385
    Abstract: An improved Phase Locked Loop (PLL) for digital integrated circuits. A characteristic of this PLL is that the Voltage Controlled Oscillator (VCO) output is fed to the phase and frequency detector (PFD) input through a clock-tree replica providing a delay equal to the routed clock tree. “This enables the PLL to maintain the proper phase even during a sleep mode of operation.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: May 3, 2005
    Assignee: STMicroelectronics PVT. Ltd.
    Inventors: Rajesh Bajaj, Nipun Padha
  • Publication number: 20040104750
    Abstract: An improved Phase Locked Loop (PLL) for digital integrated circuits. A characteristic of this PLL is that the Voltage Controlled Oscillator (VCO) output is fed to the phase and frequency detector (PFD) input through a clock-tree replica providing a delay equal to the routed clock tree.
    Type: Application
    Filed: August 12, 2003
    Publication date: June 3, 2004
    Applicant: STMicroelectronics Pvt. Ltd.
    Inventors: Rajesh Bajaj, Nipun Padha