Patents by Inventor Rajesh Chivukula

Rajesh Chivukula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230314557
    Abstract: A frequency modulated continuous wave (FMCW) radar antenna that may provide isolation between the transmit (Tx) antenna and the receive (Rx) antenna based on the arrangement of the transmit elements and the receive elements. The transmit antenna elements for the antenna of this disclosure may be orthogonally fed, e.g., different by 90 degrees, compared to the receive antenna elements. For example, for horizontally polarized receive antenna elements, the transmit elements may be vertically polarized, or vice versa. The cross-polarized antenna elements may cause attenuation of surface waves between the Tx and Rx antennae. A low insertion loss 90-degree polarizer layer over one of the transmitter antenna, or the receiver antenna, to convert either the transmitted signals or the received reflections by 90-degrees so the reflected signal matches the polarization of the receiver antenna.
    Type: Application
    Filed: July 20, 2022
    Publication date: October 5, 2023
    Inventor: Rajesh Chivukula
  • Patent number: 11476578
    Abstract: Disclosed is a dual band antenna with a first radiating element oriented at a first predetermined angle that operates in a first frequency band and a second radiating element oriented at a second predetermined angle that operates in a second frequency band. The dual band antenna has a ground plane that has a first slot that is associated with the first radiating element and a second slot that is associated with the second radiating element. The dual band antenna also has a first feed probe that is associated with the first radiating element and a second feed probe that is associated with the second radiating element.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: October 18, 2022
    Assignee: Honeywell International Inc.
    Inventor: Rajesh Chivukula
  • Publication number: 20210143548
    Abstract: Disclosed is a dual band antenna with a first radiating element oriented at a first predetermined angle that operates in a first frequency band and a second radiating element oriented at a second predetermined angle that operates in a second frequency band. The dual band antenna has a ground plane that has a first slot that is associated with the first radiating element and a second slot that is associated with the second radiating element. The dual band antenna also has a first feed probe that is associated with the first radiating element and a second feed probe that is associated with the second radiating element.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 13, 2021
    Inventor: Rajesh CHIVUKULA
  • Patent number: 10903581
    Abstract: This disclosure is directed to techniques to improve the mechanical reliability and strength of slot array antennae created using printed circuit board (PCB) technology. In some examples, a multi-layer PCB may have a limit on the length and width dimensions. Therefore, a larger slot array antenna may require two or more PCBs to create the full size of the antenna. This disclosure describes techniques to securely connect the two or more PCBs to withstand environments where the slot array antenna may be placed under mechanical stress, such as vibration. A PCB based antenna may define the walls of radiating waveguides with vias between the layers of the PCB. Mechanical fasteners may pass through some of the existing vias to secure the PCB to a support structure, such as a feeding waveguide, as well as to secure one PCB to other PCBs.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Honeywell International Inc.
    Inventors: Weihong Zhao, Nigel Wang, Rajesh Chivukula
  • Publication number: 20200412012
    Abstract: This disclosure is directed to techniques to improve the mechanical reliability and strength of slot array antennae created using printed circuit board (PCB) technology. In some examples, a multi-layer PCB may have a limit on the length and width dimensions. Therefore, a larger slot array antenna may require two or more PCBs to create the full size of the antenna. This disclosure describes techniques to securely connect the two or more PCBs to withstand environments where the slot array antenna may be placed under mechanical stress, such as vibration. A PCB based antenna may define the walls of radiating waveguides with vias between the layers of the PCB. Mechanical fasteners may pass through some of the existing vias to secure the PCB to a support structure, such as a feeding waveguide, as well as to secure one PCB to other PCBs.
    Type: Application
    Filed: June 26, 2019
    Publication date: December 31, 2020
    Inventors: Weihong Zhao, Nigel Wang, Rajesh Chivukula