Abstract: Test input/output speed conversion and related apparatuses and methods are disclosed. An apparatus includes a glue circuit and a BIST circuit for core circuitry of an integrated circuit device. The, the BIST circuit includes a test interface, one or more inputs, and one or more outputs. The BIST circuit is configured to operate at a first speed. The glue circuit is configured to interface with the test interface, the one or more inputs, and the one or more outputs of the BIST circuit. The glue circuit is configured to convert between second speed test interface signals and second speed input/output signals operating at a second speed and first speed test interface signals and first speed input/output signals operating at the first speed. The second speed is different from the first speed.

Abstract: Wafer-level testing of multiple adjacent semiconductor die of a semiconductor wafer in parallel using built-in self-test circuitry for a memory (mBIST) and scribe lines that connect certain terminals of a semiconductor die to terminals of an adjacent semiconductor die. During the wafer-level testing, probe needles of a test setup connect to a single one of the multiple adjacent semiconductor die, and mBIST commands are passed from the single one of the multiple adjacent semiconductor die to one or more adjacent semiconductor die. In some examples, the scribe lines connect mBIST circuit terminals of one semiconductor die to mBIST circuit terminals of an adjacent semiconductor die. In some examples, the scribe lines connect I/O terminals of one semiconductor die to I/O terminals of an adjacent semiconductor die. The scribe lines may cross scribe regions of the wafer to connect the respective terminals of the adjacent semiconductor die.

Abstract: Test input/output speed conversion and related apparatuses and methods are disclosed. An apparatus includes a glue circuit and a BIST circuit for core circuitry of an integrated circuit device. The, the BIST circuit includes a test interface, one or more inputs, and one or more outputs. The BIST circuit is configured to operate at a first speed. The glue circuit is configured to interface with the test interface, the one or more inputs, and the one or more outputs of the BIST circuit. The glue circuit is configured to convert between second speed test interface signals and second speed input/output signals operating at a second speed and first speed test interface signals and first speed input/output signals operating at the first speed. The second speed is different from the first speed.

Abstract: Wafer-level testing of multiple adjacent semiconductor die of a semiconductor wafer in parallel using built-in self-test circuitry for a memory (mBIST) and scribe lines that connect certain terminals of a semiconductor die to terminals of an adjacent semiconductor die. During the wafer-level testing, probe needles of a test setup connect to a single one of the multiple adjacent semiconductor die, and mBIST commands are passed from the single one of the multiple adjacent semiconductor die to one or more adjacent semiconductor die. In some examples, the scribe lines connect mBIST circuit terminals of one semiconductor die to mBIST circuit terminals of an adjacent semiconductor die. In some examples, the scribe lines connect I/O terminals of one semiconductor die to I/O terminals of an adjacent semiconductor die. The scribe lines may cross scribe regions of the wafer to connect the respective terminals of the adjacent semiconductor die.