Abstract: The semiconductor cooling arrangement comprises one or more semiconductor assemblies, a housing, and one or more baffles. Each semiconductor assembly comprises a heatsink, a semiconductor die, an encapsulant, and electrical connections. The semiconductor die is bonded to the heatsink and contains a semiconductor power device. The encapsulant covers the semiconductor die. The side of the heatsink to which the semiconductor die is bonded extends beyond the encapsulant. The electrical connections pass through the encapsulant and to the semiconductor die. The housing has a chamber for housing the one or more assemblies. Each baffle comprises through-holes arranged such that fluid flows through the through-holes to a region of a respective semiconductor assembly to which the semiconductor power device is mounted, or to a region of the heatsink of the semiconductor assembly opposite a location to which the semiconductor power device is mounted.

Abstract: A semiconductor cooling arrangement. The semiconductor cooling arrangement comprises one or more semiconductor assemblies, a housing, and one or more baffles. Each assembly comprises a heatsink and one or more semiconductor power devices mounted on and thermally coupled to the heatsink. The housing is for housing the one or more assemblies in a chamber within the housing, and comprises inlet and outlet ports in fluid communication with the chamber. The baffles are arranged such that fluid flows through each baffle to a respective heatsink. Each baffle comprises through-holes arranged such that fluid flows through the through holes to a region of the semiconductor assembly to which a semiconductor power device is mounted, or to a region of the heatsink opposite a location to which a semiconductor power device is mounted.

Abstract: A cooling arrangement, for cooling power devices such as semiconductor power devices, comprises a housing having sidewalls around the periphery of a baseplate, and a capping plate opposing the baseplate. The housing forms a cavity through which cooling fluid may flow between an inlet and an outlet disposed in the housing. Within the cavity is provided one or more baffles that are arranged to force the cooling fluid flowing between the inlet and outlet along a labyrinthine path through the cavity. At least one of the baffles comprises at least one through-hole, which permit cooling fluid to pass there through from one side of the baffle to the other.