Patents by Inventor Rajesh Kumar PUTTI

Rajesh Kumar PUTTI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid-state power amplifiers with cooling capabilities
    Patent number: 11870202
    Abstract: Methods and apparatus for processing a substrate. For example, a processing chamber can include a power source, an amplifier connected to the power source, comprising at least one of a gallium nitride (GaN) transistor or a gallium arsenide (GaAs) transistor, and configured to amplify a power level of an input signal received from the power source to heat a substrate in a process volume, and a cooling plate configured to receive a coolant to cool the amplifier during operation.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: January 9, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajesh Kumar Putti, Vinodh Ramachandran, Ananthkrishna Jupudi, Lean Wui Koh, Prashant Agarwal
  • Microwave window including first and second plates with vertical stepped areas configured for pressure sealing a dielectric plate between the first and second plates
    Patent number: 11362404
    Abstract: Apparatus for transmitting microwaves into a process chamber using a microwave pressure window assembly. The microwave pressure window assembly may include a first plate with a first aperture surrounded by a first recess for a first pressure seal, a second plate with a second aperture surrounded by a second recess for a second pressure seal, a dielectric plate configured to transmit microwaves and interposed between the first plate and the second plate and between the first pressure seal and the second pressure seal. The apertures include a first vertical step area on a first vertical side of the apertures and a second vertical step area on a second vertical side of the apertures opposite of the first vertical side. The first vertical step areas and the second vertical step areas may have a thickness of approximately 50% of a thickness of the plates that includes a dielectric plate recess.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: June 14, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajesh Kumar Putti, Prashant Agarwal, Ananthkrishna Jupudi
  • A MICROWAVE WINDOW INCLUDING FIRST AND SECOND PLATES WITH VERTICAL STEPPED AREAS CONFIGURED FOR PRESSURE SEALING A DIELECTRIC PLATE BETWEEN THE FIRST AND SECOND PLATES
    Publication number: 20220140456
    Abstract: Apparatus for transmitting microwaves into a process chamber using a microwave pressure window assembly. The microwave pressure window assembly may include a first plate with a first aperture surrounded by a first recess for a first pressure seal, a second plate with a second aperture surrounded by a second recess for a second pressure seal, a dielectric plate configured to transmit microwaves and interposed between the first plate and the second plate and between the first pressure seal and the second pressure seal. The apertures include a first vertical step area on a first vertical side of the apertures and a second vertical step area on a second vertical side of the apertures opposite of the first vertical side. The first vertical step areas and the second vertical step areas may have a thickness of approximately 50% of a thickness of the plates that includes a dielectric plate recess.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 5, 2022
    Inventors: Rajesh Kumar PUTTI, Prashant AGARWAL, Ananthkrishna JUPUDI
  • SOLID-STATE POWER AMPLIFIERS WITH COOLING CAPABILITIES
    Publication number: 20220069536
    Abstract: Methods and apparatus for processing a substrate. For example, a processing chamber can include a power source, an amplifier connected to the power source, comprising at least one of a gallium nitride (GaN) transistor or a gallium arsenide (GaAs) transistor, and configured to amplify a power level of an input signal received from the power source to heat a substrate in a process volume, and a cooling plate configured to receive a coolant to cool the amplifier during operation.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 3, 2022
    Inventors: Rajesh Kumar PUTTI, Vinodh RAMACHANDRAN, Ananthkrishna JUPUDI, Lean Wui KOH
  • Microwave transmission window assembly
    Patent number: D967081
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: October 18, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajesh Kumar Putti, Prashant Agarwal, Ananthkrishna Jupudi