Abstract: A process for producing an ethylene copolymer, the process including: (a) contacting ethylene with at least one polar comonomer in the presence of at least one modifier and at least one free radical initiator in a tubular reactor under polymerization conditions including a pressure of from 225 to 270 MPa; (b) injecting the at least one free radical initiator into the reactor at a plurality of reaction zones spaced along the length of the reactor, wherein each reaction zone comprises an inlet and an outlet; (c) maintaining the temperature at the inlet of each reaction zone at 150° C. or less, and the temperature at the outlet of each reaction zone is at least 177° C.; (d) controlling the modifier flow at a rate of from 0.02 to 0.986 wt % of the copolymer; and (e) recovering the ethylene copolymer from the tubular reactor, is provided.

Abstract: A pressure-sensitive adhesive may comprise: about 18 wt % to about 90 wt % of a propylene-ethylene(-diene) (PE(D)M) copolymer; about 10 wt % to about 65 wt % of a tackifier; and 0 wt % to about 40 wt % of an oil. The PE(D)M copolymer may comprise: (a) about 60 wt % to about 99 wt % propylene, (b) about 1 wt % to about 40 wt % ethylene or a C4 to C22 alpha-olefin, and (c) 0 wt % to about 20 wt % diene, wherein the PE(D)M copolymer has a heat of fusion of about 15 J/g or less.

Abstract: Amorphous propylene-ethylene copolymers are described herein that can include high amounts of ethylene and exhibit desirable softening points and needle penetrations. The desirable combinations of softening points and needle penetrations in these propylene-ethylene copolymers allow them to have a broad operating window. Due their broad operating window, the propylene-ethylene copolymers can be utilized in a wide array of applications and products, including hot melt adhesives.

Abstract: Amorphous propylene-ethylene copolymers are described herein that can include high amounts of ethylene and exhibit desirable softening points and needle penetrations. The desirable combinations of softening points and needle penetrations in these propylene-ethylene copolymers allow them to have a broad operating window. Due their broad operating window, the propylene-ethylene copolymers can be utilized in a wide array of applications and products, including hot melt adhesives.

Abstract: Amorphous propylene-ethylene copolymers are described herein that can include high amounts of ethylene and exhibit desirable softening points and needle penetrations. The desirable combinations of softening points and needle penetrations in these propylene-ethylene copolymers allow them to have a broad operating window. Due their broad operating window, the propylene-ethylene copolymers can be utilized in a wide array of applications and products, including hot melt adhesives.

Abstract: Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.