Abstract: This invention relates to a composition suitable for use in making moisture resistant gypsum products. In particular, this invention relates to resin dispersions and their use in combination with gypsum to form moisture resistant gypsum compositions which are settable by hydration. Further, the invention relates to moisture resistant products formed from such settable gypsum compositions, e.g. panels and boards, and a method for the manufacture of such moisture resistant gypsum products.

Abstract: A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.

Abstract: This invention relates to a composition suitable for use in making moisture resistant gypsum products. In particular, this invention relates to resin dispersions and their use in combination with gypsum to form moisture resistant gypsum compositions which are settable by hydration. Further, the invention relates to moisture resistant products formed from such settable gypsum compositions, e.g. panels and boards, and a method for the manufacture of such moisture resistant gypsum products.

Abstract: This invention relates to a composition suitable for use in making moisture resistant gypsum products. In particular, this invention relates to resin dispersions and their use in combination with gypsum to form moisture resistant gypsum compositions which are settable by hydration. Further, the invention relates to moisture resistant products formed from such settable gypsum compositions, e.g. panels and boards, and a method for the manufacture of such moisture resistant gypsum products.

Abstract: Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formula I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: This invention relates to a composition suitable for use in making moisture resistant gypsum products. In particular, this invention relates to resin dispersions and their use in combination with gypsum to form moisture resistant gypsum compositions which are settable by hydration. Further, the invention relates to moisture resistant products formed from such settable gypsum compositions, e.g. panels and boards, and a method for the manufacture of such moisture resistant gypsum products.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: A polymer includes a first type of repeat unit represented by Formula I: where X is selected from —CH2—, —CH2—CH2—, or —O—; m is an integer from 0 to about 5; and where for the first type of repeat unit one of R1, R2, R3, and R4 is one of a maleimide containing group and for the second type of repeat unit one of R1, R2, R3, and R4 is a hindered aromatic group, a C8 or greater alkyl group, a C4 or greater halohydrocarbyl or perhalocarbyl group, a C7 or greater aralkyl group, or a heteroatom hydrocarbyl or halohydrocarbyl group.