Patents by Inventor Rajeswaran Radhakrishnan

Rajeswaran Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240384430
    Abstract: A method, coated substrate, and coating wherein a metallic substrate is subject to an electrolytic deposition process including an electrolyte with an iron group element and a refractory group element. One or more electrolytic deposition waveform parameters are varied to deposit on the substrate a functionally graded coating with more of the iron group element and less of the refractory group element at an interface between the coating and the metallic substrate to better match the coefficient of thermal expansion of the coating and the metallic substrate and more of the refractory group element and less of the iron group element as the thickness of the coating increases for improving corrosion resistance to salts. The coating may be diffusion bonded to the substrate.
    Type: Application
    Filed: April 17, 2024
    Publication date: November 21, 2024
    Inventors: Timothy D. Hall, Rajeswaran Radhakrishnan, Holly Garich, Katherine Lee
  • Publication number: 20230121487
    Abstract: A method of coating a substrate, the method comprises adding a nanocarbon material to an electrophoretic solution in an electrophoretic deposition apparatus including the substrate and an electrode spaced from the substrate, and applying a current to the substrate and the electrode to deposit the nanocarbon material onto the substrate.
    Type: Application
    Filed: September 27, 2022
    Publication date: April 20, 2023
    Inventors: Dan Wang, Timothy David Hall, Maria E. Inman, Rajeswaran Radhakrishnan, Earl Jennings Taylor
  • Publication number: 20230047661
    Abstract: A method of coating a substrate includes adding ion erosion resistant particles, conductive particles, and a binder to an electrophoretic solution in an electrophoretic deposition apparatus including the substrate and a cathode spaced from the substrate. A current is applied to the substrate and cathode to deposit a first layer coating including the erosion resistant particles, the conductive particles, and the binder onto the substrate. The method further includes adding a low work function material to an electrolyte solution in an electrolytic deposition apparatus including the substrate and a cathode spaced from the substrate. A current is applied to the substrate and the cathode to deposit a second layer coating including the low work function material onto the substrate.
    Type: Application
    Filed: April 8, 2022
    Publication date: February 16, 2023
    Inventors: Rajeswaran Radhakrishnan, Danny Xin Liu, Dan Wang, Timothy D. Hall, Maria E. Inman
  • Publication number: 20200378028
    Abstract: A method of plating a workpiece, the method includes electrochemically removing any oxide on the surface of the workpiece by applying a first waveform to the workpiece and a cathode both placed in a first electrolyte solution, and electroplating the workpiece surface by applying a second waveform to the workpiece and an anode both placed in a second electrolyte solution including a plating material.
    Type: Application
    Filed: May 7, 2020
    Publication date: December 3, 2020
    Inventors: Maria E. Inman, Jing Xu, Timothy D. Hall, Earl Jennings Taylor, Alan Bonifas, Rajeswaran Radhakrishnan