Abstract: Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

Abstract: Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

Abstract: Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

Abstract: Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

Abstract: In various embodiments, rail decoupling circuits that are powered by an always on voltage rail allow a core voltage rail to power up independently of an I/O voltage rail without jeopardizing I/O pad circuits that are powered by the I/O voltage rail. In an embodiment, when the always on voltage rail is powered-up and a chip reset signal is asserted, the rail decoupling circuits drive control inputs of the I/O pad circuits based on default values. When the chip reset signal is de-asserted, the rail decoupling circuits drive the control inputs of the I/O pad circuits based on signals received from circuits powered by the core voltage rail. Because the rail decoupling circuits maintain control of the I/O pad circuits until the chip-reset is de-asserted, the core voltage rail can power up at any time before the chip-reset signal is de-asserted irrespective of when the I/O voltage rail powers up.

Abstract: In various embodiments, rail decoupling circuits that are powered by an always on voltage rail allow a core voltage rail to power up independently of an I/O voltage rail without jeopardizing I/O pad circuits that are powered by the I/O voltage rail. In an embodiment, when the always on voltage rail is powered-up and a chip reset signal is asserted, the rail decoupling circuits drive control inputs of the I/O pad circuits based on default values. When the chip reset signal is de-asserted, the rail decoupling circuits drive the control inputs of the I/O pad circuits based on signals received from circuits powered by the core voltage rail. Because the rail decoupling circuits maintain control of the I/O pad circuits until the chip-reset is de-asserted, the core voltage rail can power up at any time before the chip-reset signal is de-asserted irrespective of when the I/O voltage rail powers up.

Abstract: Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

Abstract: An electronic circuit comprises at least one digital logic circuit; and a power control circuit. The power control circuit is operable to adjust the voltage of a power signal supplied to the at least one digital logic circuit in response to a change in a clock frequency provided to the at least one digital logic circuit. In a further embodiment, the power controller is operable to increase the voltage of the power signal applied to the digital logic circuit before a frequency increase is made, and is operable to decrease the voltage of the power signal applied to the digital logic circuit after a frequency decrease is made.

Abstract: An electronic circuit comprises at least one digital logic circuit; and a power control circuit. The power control circuit is operable to adjust the voltage of a power signal supplied to the at least one digital logic circuit in response to a change in a clock frequency provided to the at least one digital logic circuit. In a further embodiment, the power controller is operable to increase the voltage of the power signal applied to the digital logic circuit before a frequency increase is made, and is operable to decrease the voltage of the power signal applied to the digital logic circuit after a frequency decrease is made.

Abstract: A computerized system includes at least one digital logic circuit and a power control circuit. The power control circuit is operable to reduce the voltage of a power signal applied to the at least one digital logic circuit, operable to bring the digital logic circuit from a high power level to a low power level, and operable to increase the voltage of the power signal applied to the digital logic circuit before bringing the digital logic circuit from a low power level to a high power level.