Patents by Inventor Rajiv Bajaj

Rajiv Bajaj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Simplification of ball attach method using super-saturated fine crystal flux
    Patent number: 7108755
    Abstract: A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: September 19, 2006
    Assignee: Motorola, Inc.
    Inventors: Li Ann Wetz, Lizabeth Ann Keser, Rajiv Bajaj, Treliant Fang
  • Simplification of ball attach method using super-saturated fine crystal flux
    Publication number: 20040020562
    Abstract: A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.
    Type: Application
    Filed: July 30, 2002
    Publication date: February 5, 2004
    Applicant: Motorola Inc.
    Inventors: Li Ann Wetz, Lizabeth Ann Keser, Rajiv Bajaj, Treliant Fang
  • Semiconductor wafer wax mounting and thinning process
    Patent number: 5256599
    Abstract: A wax (13) dissolved in solvent is placed on a semiconductor wafer (12) and made uniform. An assembly is formed by bonding the semiconductor wafer (12) to a submount (17) with a uniform wax layer (14). The submount (17) supports and allows handling of the semiconductor wafer (12) during wafer process steps. The assembly is heated in a vacuum to remove solvent and air trapped in the uniform wax layer (14) thereby minimizing air voids which can cause a non-uniform bond. The assembly is then annealed to reduce stress on the semiconductor wafer (12) induced by differing material thermal expansion rates of the semiconductor wafer (12), the uniform wax layer (14), and the submount (17).
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: October 26, 1993
    Assignee: Motorola, Inc.
    Inventors: Paul D. Asetta, Rajiv Bajaj, Lawrence R. Gardner, Michael P. Norman, James J. Wang