Abstract: Various implementations described herein are directed to an integrated circuit. The integrated circuit may include core circuitry having an array of memory cells and a row decoder that accesses each of the memory cells via a selected wordline and a wordline signal. The core circuitry may operate at a first supply voltage. The integrated circuit may include periphery circuitry having a column decoder that accesses each of the memory cells via a selected bitline. The periphery circuitry may operate at a second supply voltage that is different than the first supply voltage. The periphery circuitry may include voltage differential sensing circuitry that may compare the first supply voltage to the second supply voltage, sense a voltage differential between the first and second supply voltages, and delay the wordline signal when the voltage differential is greater than a threshold voltage.

Abstract: Various implementations described herein are directed to an integrated circuit having high density memory architecture. The integrated circuit may include a plurality of bank arrays having multiple segments of bitcells configured to share local control. The integrated circuit may include a plurality of control lines coupling the local control to each of the multiple segments of bitcells. In some instances, during activation of a segment of bitcells by the local control via one of the control lines, another segment of bitcells may be deactivated by the local control via another of the control lines.

Abstract: Single-ended read circuits for SRAM devices are disclosed for high performance sub-micron designs. One embodiment is an SRAM device that includes a memory cell array and a bit line traversing the memory cell array for reading data from memory cells of the memory cell array. A read circuit coupled to the bit line translates data stored in a memory cell from a cell voltage of the memory cells to a peripheral voltage of an output of the SRAM device while bypassing a level shifter in the read data path.

Abstract: SRAM devices are disclosed that utilize write assist circuits to improve the logical transitions of bit lines. In one embodiment, an SRAM device includes a pair of complimentary bit lines traversing a memory cell array for writing data to memory cells. The bit lines have a first end and a second end. A pair of complimentary write drivers is proximate to the first end of the bit lines that writes to the bit lines. A write assist circuit is proximate to the second end of the bit lines that receives a pre-charge signal to assist the write drivers in transitioning the bit lines from a logical zero state to a logical one state. The write assist circuit also receives a boost signal to assist the write drivers in transitioning the bit lines from a logical one state to a logical zero state.

Abstract: Word line decoders for dual rail SRAM devices are disclosed for high performance sub-micron SRAM designs. One embodiment is an SRAM device that includes a memory cell array and a word line traversing the memory cell array for selecting memory cells of the memory cell array. A row decode-driver coupled to the word line toggles the word line between logic levels of a memory cell supply based on select signals that toggle between logic levels of a peripheral supply. The row decoder-driver toggles the word line without utilizing level shifters along the word line access path.

Abstract: A read-only memory (ROM) cell has first and second transistors connected in series between a true bit line and a voltage reference (e.g., ground), and third and fourth transistors connected in series between a complement bit line and the voltage reference. The gates of the first and third transistors are connected to a first word line, and the gates of the second and fourth transistors are connected to a second word line. The ROM cell is programmed to store any possible combination of two bits of information by appropriately (i) connecting the node between the first and second transistors to either the true bit line, the complement bit line, or the voltage reference and (ii) connecting the node between the third and fourth transistors to either the true bit line, the complement bit line, or the voltage reference.

Abstract: SRAM devices are disclosed that utilize write assist circuits to improve the logical transitions of bit lines. In one embodiment, an SRAM device includes a pair of complimentary bit lines traversing a memory cell array for writing data to memory cells. The bit lines have a first end and a second end. A pair of complimentary write drivers is proximate to the first end of the bit lines that writes to the bit lines. A write assist circuit is proximate to the second end of the bit lines that receives a pre-charge signal to assist the write drivers in transitioning the bit lines from a logical zero state to a logical one state. The write assist circuit also receives a boost signal to assist the write drivers in transitioning the bit lines from a logical one state to a logical zero state.

Abstract: Word line assist circuits are disclosed for high performance sub-micron SRAM designs. One embodiment is an SRAM device that includes a memory cell array and a pair of word lines that traverse the memory cell array for selecting memory cells. The SRAM device further includes a pair of word line drivers, each coupled to one of the word lines. The SRAM device further includes a word line assist circuit coupled to the pair of word lines that receives an enable signal. Responsive to receiving the enable signal, the word line assist circuit assists the first word line driver and the second word line driver in transitioning their respective word lines from a logic level zero to a logic level one in response to a voltage differential between the word lines.

Abstract: A Read Only Memory (ROM) and method for providing a high operational speed with reduced leakage, no core cell standby leakage, and low power consumption. The source of the ROM cell (NMOS) is connected to a virtual ground line (VNGD) instead of VSS. Thus, the ROM cell can be operatively coupled to the bit-line, the word-line, and the virtual ground, which also acts as a column select signal. The arrangement of the ROM is such that the virtual ground of the selected column is pulled down to a ground voltage. Non-selected columns virtual ground can be maintained at a supply voltage to ensure that unwanted columns will not have any sub-threshold current (as Vds=0). Since no pre-charging of bit-line comes in the access time path, the ROM achieves a high operational speed with reduced leakage and low power consumption.

Abstract: An SRAM device includes a plurality of memory cells and a first metallization layer comprising a first pair of bitlines operable to couple to a first segment of the memory cells. The device also includes a second metallization layer comprising a second pair of bitlines operable to couple to a second segment of the memory cells and a write assist line interleaved with the first and second metallization layers to provide a substantially constant coupling capacitance with each of the first and second pairs of bitlines.

Abstract: An SRAM device includes a segmented memory cell array with a plurality of memory cells. Each segment of memory cells includes a bitline coupled to the memory cells in the segment. The SRAM device further includes a global bitline traversing the segmented memory cell array and communicatively coupled to the memory cell segments via the local bitlines for writing to the memory cells. The SRAM device further includes a global input/output module operable to hold the global bitline at logical zero, to toggle the global bitline to logical one when data is to be written, to select one of the segments of memory cells for writing after the global bitline has been toggled, and to toggle the global bitline to logical zero when data is written to the selected memory cell segment to provide a negative boost voltage to the local bitline of the selected memory cell segment.

Abstract: Systems and methods presented herein provide a memory system which includes a memory cell array. The memory cell array includes first and second segments with corresponding local bitlines connected to one or more memory cells. The memory cell array also includes first and a second metallization layers. The second metallization layer includes first and second global bitlines. The first metallization layer includes local bitlines. In each of the first segments, local bitlines are connected to one of the first global bitlines. In each of the second segments, local bitlines are connected to one of the second global bitlines.

Abstract: A Read Only Memory (ROM) and method for providing a high operational speed with reduced leakage, no core cell standby leakage, and low power consumption. The source of the ROM cell (NMOS) is connected to a virtual ground line (VNGD) instead of VSS. Thus, the ROM cell can be operatively coupled to the bit-line, the word-line, and the virtual ground, which also acts as a column select signal. The arrangement of the ROM is such that the virtual ground of the selected column is pulled down to a ground voltage. Non-selected columns virtual ground can be maintained at a supply voltage to ensure that unwanted columns will not have any sub-threshold current (as Vds=0). Since no pre-charging of bit-line comes in the access time path, the ROM achieves a high operational speed with reduced leakage and low power consumption.

Abstract: A read-only memory (ROM) cell has first and second transistors connected in series between a true bit line and a voltage reference (e.g., ground), and third and fourth transistors connected in series between a complement bit line and the voltage reference. The gates of the first and third transistors are connected to a first word line, and the gates of the second and fourth transistors are connected to a second word line. The ROM cell is programmed to store any possible combination of two bits of information by appropriately (i) connecting the node between the first and second transistors to either the true bit line, the complement bit line, or the voltage reference and (ii) connecting the node between the third and fourth transistors to either the true bit line, the complement bit line, or the voltage reference.

Abstract: A system is capable of assisting in reset of a data storage array including data storage array including one or more data storage array nodes. The system includes a control unit coupled to the data storage array configured to produce a control signal to reset the data storage array, and a reset unit communicatively coupled to the data storage array and the control unit configured to reset the data storage array by charge injection to the one or more data storage array nodes.

Abstract: A system is capable of assisting in reset of a data storage array including data storage array including one or more data storage array nodes. The system includes a control unit coupled to the data storage array configured to produce a control signal to reset the data storage array, and a reset unit communicatively coupled to the data storage array and the control unit configured to reset the data storage array by charge injection to the one or more data storage array nodes.