Patents by Inventor Rajiv Singh

Rajiv Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050054743
    Abstract: This invention provides azeotrope-like compositions of 1,1,1,3,3-pentafluoropropane and water that are environmentally desirable for use as refrigerants, aerosol propellants, metered dose inhalers, blowing agents for polymer foam, heat transfer media, and gaseous dielectrics.
    Type: Application
    Filed: September 16, 2004
    Publication date: March 10, 2005
    Inventors: Leslie Bement, Mary Bogdan, Clayton Carson, Peter Logsdon, Hang Pham, Rajiv Singh, Hsueh Tung, Ronald Riegal, David Williams, Kevin Uhrich
  • Publication number: 20050042758
    Abstract: A method of detecting a leakage of a chemical from a closed system into the environment and/or revealing the location of the leakage is provided. The method includes the steps of: placing a test strip in close proximity of or in direct contact with a suspected leak in the closed system, the test strip including a support material and a color forming composition disposed on the support material, the color forming composition including a dye precursor encapsulated in a microcapsule, a developer and optionally a filler; and detecting development of a color on the test strip in response to contact of the microcapsule with the chemical thereby indicating the presence of and/or the revealing the location of the leak.
    Type: Application
    Filed: August 20, 2003
    Publication date: February 24, 2005
    Inventors: Gary Zyhowski, Rajiv Singh, Raymond Thomas
  • Publication number: 20040043702
    Abstract: A slurry and related method for chemical mechanical polishing (CMP) of a metal film includes a solution containing at one halide ion and at least one halogen species which react with the metal film to form a surface layer on the film. The surface layer formed can be a metal halide layer. The surface layer can be removed by abrasive particles embedded in the polishing pad, or a thin inorganic layer coated on the polishing pad.
    Type: Application
    Filed: August 22, 2003
    Publication date: March 4, 2004
    Inventor: Rajiv Singh