Patents by Inventor Rajive Ranade

Rajive Ranade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for dry etching deep trenches in a substrate
    Publication number: 20020094690
    Abstract: A method for etching trenches in a substrate secures a wafer to an electrode in a plasma chamber and heats the wafer to a temperature of greater than 200 degrees Celsius. The wafer is exposed to a reactive plasma to etch trenches into the substrate of the wafer with minimal redeposition of etch by-products to avoid pinching off the trench and to promote further etching.
    Type: Application
    Filed: January 9, 2001
    Publication date: July 18, 2002
    Inventors: Satish Athavale, Rajive Ranade, Munir Naeem, Gangadhara Swami Mathad