Patents by Inventor Rajkumar Ramamurthi

Rajkumar Ramamurthi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for wafer dicing and composition useful thereof
    Patent number: 9328318
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: May 3, 2016
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Method for wafer dicing and composition useful thereof
    Patent number: 8883701
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: November 11, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Method for Wafer Dicing and Composition Useful Thereof
    Publication number: 20140170835
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 19, 2014
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
    Patent number: 8580656
    Abstract: Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: November 12, 2013
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Terence Quintin Collier, Charles A. Lhota, David Barry Rennie, Rajkumar Ramamurthi, Madhukar Bhaskara Rao, Dnyanesh Chandrakant Tamboli
  • Method for Wafer Dicing and Composition Useful Thereof
    Publication number: 20120009762
    Abstract: A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 12, 2012
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Dnyanesh Chandrakant Tamboli, Rajkumar Ramamurthi, David Barry Rennie, Madhukar Bhaskara Rao, Gautam Banerjee, Gene Everad Parris
  • Process for Inhibiting Corrosion and Removing Contaminant from a Surface During Wafer Dicing and Composition Useful Therefor
    Publication number: 20100009517
    Abstract: Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
    Type: Application
    Filed: July 8, 2009
    Publication date: January 14, 2010
    Applicant: AIR PRODUCTS AND CHEMICALS, INC.
    Inventors: Terence Quintin Collier, Charles A. Lhota, David Barry Rennie, Rajkumar Ramamurthi, Madhukar Bhaskara Rao, Dnyanesh Chandrakant Tamboli