Abstract: A system and method for assisting a patient in setting up and using respiratory therapy device is disclosed. The system includes an equipment database storing data relating to respiratory therapy device types and mask types. A device recognition module is operable to identify the type of the respiratory therapy device from an image of the respiratory therapy device captured by a client computing device in comparison with the data relating to the device types. A mask recognition module is operable to identify the type of the mask from an image of the mask captured by the client computing device in comparison with the data relating to the mask types. A media database includes media relating to assistance information relating to mask types and device types. A management server is operable to send media relating to assistance information for the identified type of mask or identified type of device to the client computing device.

Abstract: Systems/methods for delivery and control of medications for patient use and, more particularly, to dispenser-based systems that facilitate access to and use of individually packaged sets of medications (e.g., pills, tablets and the like), and associated control functionalities that monitor and communicate the status/inventory of medications associated with the dispenser-based system, are provided. Systems/methods that include indicia associated with the packaged sets of medications and for “reading” the indicia to monitor or determine the status or position of the packaged set of medications are also provided.

Abstract: Systems/methods for delivery and control of medications for patient use and, more particularly, to dispenser-based systems that facilitate access to and use of individually packaged sets of medications (e.g., pills, tablets and the like), and associated control functionalities that monitor and communicate the status/inventory of medications associated with the dispenser-based system, are provided. Systems/methods that include indicia associated with the packaged sets of medications and for “reading” the indicia to monitor or determine the status or position of the packaged set of medications are also provided.

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Abstract: The disclosure provides biocompatible metal compositions, methods of making such compositions and uses thereof, including a method of synthesizing zeolite coatings. The disclosure further provides the zeolite-hydroxyapatite composite coatings and methods of making them, which includes forming a base zeolite layer, forming a hydroxyapatite layer on the base zeolite layer, and interlocking the hydroxyapatite layer with an outer zeolite layer. The composite can be formed on a metal substrate for bioimplants, such as titanium alloy and/or stainless steel, which is used for bioimplants.

Abstract: Printed circuit boards have circuit layers with one or more via filled holes with copper wraps and methods of manufacturing the same. An embodiment of the present invention provides a method to enhance the consistency of the wraparound plating of through-hole vias of printed circuit boards with (requiring) via filling to provide extra reliability to the printed circuit boards and enables the designers and/or manufacturers of printed circuit boards to design and manufacture boards with relatively fine features and/or tight geometries.

Abstract: This invention relates to a method for increasing the effective process life and chemical efficiency of use of aqueous-based developer solutions used for chemical development of photoresists such as are used in the printed circuit industry. The activity is maintained by regenerating some of byproducts during the process to active carbonate, by controlled additions of alkaline hydroxide instead if conventional carbonate solution. The pH and thus the development speed can automatically be controlled at any desired constant value. This invention allows simple automation of printed circuit photoresist development, with reduced chemical costs and increased chemical usage efficiency and thus reducing the industrial waste volume.

Abstract: A process for control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts, by controlling the temperature and mixture rate of the removal process. The very rapid reaction can be controlled by using a diluent of copper-free etchant, heating to process temperature, then adding spent, copper containing etchant at a controlled rate while actively cooling the system to control the temperature. The copper concentration can be monitored by colorimetry while maintaining the pH above pH 8. The separated metallic copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.

Abstract: A method of improved control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts. The very rapid reaction can be controlled by using a diluent of copper-free etchant, eliminating overheating. The separated copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.

Abstract: A metal dissolving liquid and method for stripping tin and solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve tin-copper alloy, a source of halide ions in an amount sufficient to solubilize tin, an effective amount of methylsulfonic acid as promoter for complete stripping, and a source of an organic, water soluble amine. The combination of ingredients will substantially eliminate sludge formation, reduce attack on the copper substrate and provide a bright copper finish after solder removal. A liquid further including organic triazoles including benzotriazole in amounts not more than about 5% by weight and sulfamic ions in amounts not more than about 2.5% by weight.

Abstract: This invention relates to the removal of lead from spent ferric nitrate based solder strippers, the regeneration of the spent ferric nitrate based solder strippers, and the reuse of these solutions at least one time. It comprises a method and process for precipitating lead salts from used acidic solder strippers which are employed to strip solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The method includes the use of sulfate ions which are directly added to an aqueous solution of spent solder stripper, without neutralization of the spent solder stripper, optionally in combination with nitric or methylsulfonic acid addition. After precipitation and removal of the lead salts, additional components of the solder stripper composition may be added to substantially restore the initial functioning of the solder stripper.

Abstract: An electroless silver plating solution comprises a silver(I) complex, a thiosulfate salt, and a sulfite salt. This electroless silver plating solution uses a novel reducing agent combination of thiosulfate and sulfite. It shows a plating rate and a plating solution stability far superior to those of conventional silver plating solutions containing formaldehyde, reducing sugars, borohydride, hydrazine, and other reducing agents.

Abstract: An electroless silver or gold plating solution comprising a noncyanide metal complex, a thiosulfate, a sulfite, and at least one amino acid. These electroless plating solutions containing an amino acid exhibit an accelerated plating rate compared to identical solutions lacking amino acids.