Abstract: The invention provides composite materials that form a biocompatible and bioresorbable settable ceramic-forming composition, and that possesses high strength when set and other desirable mechanical properties. The composite materials may include additive materials that provide beneficial advantages in the handling and physical properties of the material. When a hydrated precursor, the composite material is capable of being injected through cannulas for placement in treatment sites. The composite material provided desirable handling properties and sets in a clinically relevant time period.

Abstract: The invention provides composite materials that form a biocompatible and bioresorbable settable ceramic-forming composition, and that possesses high strength when set and other desirable mechanical properties. The composite materials may include additive materials that provide beneficial advantages in the handling and physical properties of the material. When a hydrated precursor, the composite material is capable of being injected through cannulas for placement in treatment sites. The composite material provided desirable handling properties and sets in a clinically relevant time period.

Abstract: The invention provides composite materials that form a biocompatible and bioresorbable settable ceramic-forming composition, and that possesses high strength when set and other desirable mechanical properties. The composite materials may include additive materials that provide beneficial advantages in the handling and physical properties of the material. When a hydrated precursor, the composite material is capable of being injected through cannulas for placement in treatment sites. The composite material provided desirable handling properties and sets in a clinically relevant time period.

Abstract: An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.

Abstract: A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

Abstract: A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

Abstract: Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.

Abstract: A system for transporting and positioning a patient onto an operating room table from a movable transportation device, e.g., a stretcher, to be located immediately laterally of the operating room table and transporting back onto the movable transportation device after the surgery. The system basically comprises a first and second inflatable assemblies to effect the pivoting of the patient about a longitudinal axis extending between the table and stretcher from a supine position on the stretcher to a horizontal prone position on the table. A third inflatable assembly causes the patient's spine to be in an arcuate orientation suitable for spinal surgery.

Abstract: A system for transporting and positioning a patient onto an operating room table from a movable transportation device, e.g., a stretcher, to be located immediately laterally of the operating room table and transporting back onto the movable transportation device after the surgery. The system basically comprises a first and second inflatable assemblies to effect the pivoting of the patient about a longitudinal axis extending between the table and stretcher from a supine position on the stretcher to a horizontal prone position on the table. A third inflatable assembly causes the patient's spine to be in an arcuate orientation suitable for spinal surgery.

Abstract: A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

Abstract: Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.

Abstract: A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

Abstract: A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

Abstract: A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.