Abstract: A method for additive manufacturing process parameter monitoring of additively manufactured articles and associated raw materials, the method comprising the steps of: at an additive manufacturing raw material supplier located at a first location, packaging a raw additive manufacturing material, which may be a metal powder, and placing a sensor device inside the packaging, wherein the sensor device, which is powered by ambient energy, monitors one or more material parameters, as the packaging moves through a supply chain, and wherein sensed parameters from the sensor device are recorded periodically until the raw material is loaded to an additive manufacturing tool at a second location, different from the first location; prior to utilizing the sensor device, registering an identity for the sensor with blockchain rules to establish a trust on data originating from the sensor device; at an additive manufacturing article supplier located at the second location, using an additive manufacturing tool, manufacturing

Abstract: A method for secure transfer of an additive manufacturing design file and for process monitoring of additively manufactured articles that are manufactured in accordance with such design file includes the steps of: at an article designer located at a first location, generating the additive manufacturing design file; from the first location, sending the additive manufacturing design file to an additive manufacturing AM vendor located at a second location different from the first location; at the second location, using an additive manufacturing tool, manufacturing the article in accordance with the design file; and at the second location, and using a plurality of process monitoring devices, generating a plurality of process parameters associated with the manufacture of the article; at the second location, generating a cryptographic, distributed ledger comprising the plurality of process parameters. The ledger is generated in the manner of a block-chain.

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.