Patents by Inventor Rakesh KANDULA

Rakesh KANDULA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240110975
    Abstract: Methods and apparatus relating to techniques to provide secure remote debugging are described. In an embodiment, a debugging entity generates and transmits a host token to a device via an interface. The interface provides encrypted communication between the debugging entity and the device. The debugging entity generates a session key based at least in part on the host token and a device token. The debugging entity transmits an acknowledgement signal to the device after generation of the session key to initiate a debug session. The debugging entity transmits a debug unlock key to the device to cause the device to be unlocked for the debug session. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Intel Corporation
    Inventors: Tsvika Kurts, Vladislav Mladentsev, Elias Khoury, Rakesh Kandula, Reuven Elbaum, Boris Dolgunov
  • Publication number: 20240103077
    Abstract: Time to read the data registers in a remote Test Access Port (TAP) in a subsystem in a System-on-Chip (SoC) is reduced by reading multiple data registers in remote Test Access Ports in parallel. A Test Access Port Bridge provides access to multiple same width data registers in parallel. The same width data registers can be for the same function or different functions. The subsystems with a remote Test Access Port in the SoC can include Peripheral Component Interconnect Express (PCIe), Voltage Droop Monitors (VDMs), In-Die Variation (IDV) Monitor fub-lets, Temperature Sensors, Performance Monitors and telemetry subsystems.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Inventors: Rakesh KANDULA, Sankaran MENON, Rolf KUEHNIS
  • Publication number: 20240103079
    Abstract: Embodiments described herein may include apparatus, systems, techniques, and/or processes that are directed to performing testing of a device while a system is operational. A device may include computing circuitry and host connectivity registers. Host connectivity registers contain configuration and memory mapping data programmed by system software upon power up of the device and computing system. The data contained in host connectivity registers should be always maintained while the computing system is operational. Scan test circuitry may be implemented, providing the ability to test the device while the system is operational. Preservation circuitry preserves or maintains the data stored in host connectivity registers allowing in-operation testing of the device, ensuring the device the ability to return to full operation at the end of in-operation testing without requiring system software to reprogram the host connectivity registers.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 28, 2024
    Inventors: Rakesh Kandula, Sankaran Menon, Rolf Kuehnis
  • Publication number: 20240027516
    Abstract: Embodiments herein relate to a test, repair, and diagnostic solution for chip-to-chip interconnects. In one aspect, on a first chip, a first finite state machine (FSM) is coupled to a set of transmit lanes. To test each transmit lane, one at a time, the first FSM is to apply a first periodic signal to a transmit lane under test and concurrently apply a second periodic signal to other transmit lanes of the set of transmit lanes, where a phase of the first periodic signal is opposite to a phase of the second periodic signal. A comparator compares a detected signal on the lane under test to an expected response. The comparator can be on the first chip, when the first chip is tested alone, or on a second chip, where the two chips are tested together.
    Type: Application
    Filed: July 22, 2022
    Publication date: January 25, 2024
    Inventors: Sreejit Chakravarty, Adithya Kashyap, Vijaya Chelli, Micha Shahar, Rakesh Kandula, Dovev Amosi
  • Publication number: 20230408581
    Abstract: Techniques for interface conversion and unicast for test content, firmware, and software delivery are described. An example apparatus comprises a scan test interface coupled to multiple circuits blocks to perform a scan test for the multiple circuit blocks, and circuitry coupled to input/output (IO) signals of the scan test interface to provide content for the multiple circuit blocks and to deliver a replicated content to multiple endpoints of the multiple circuit blocks (e.g., unicast technology). In another example, the circuitry is coupled to the IO signals of the scan test interface and a system/communication interface to decode packets received at the IO signals and convert the decoded packets to provide content through the system/communication interface for the multiple circuit blocks. Other examples are described and claimed.
    Type: Application
    Filed: June 15, 2022
    Publication date: December 21, 2023
    Applicant: Intel Corporation
    Inventors: Rakesh Kandula, Sankaran Menon, Seng Choon Thor, Shivaprashant Bulusu, Eswar Vadlamani, Ramakrishnan Venkatasubramanian
  • Publication number: 20230084463
    Abstract: Runtime memory BIST techniques are described herein. In one example, a system such as an SoC includes logic to schedule runtime testing of the memory that is non-destructive in multiple phases. Running testing of memory in multiple phases includes triggering a memory built-in self-test (BIST) testing of a subset of memory locations in a phase, where the processing logic is to pause access to the memory during the phase. The processing logic can resume access to the memory between testing phases. The next region of the memory can be tested in the phase that follows. This process can continue until the entire memory is tested, without requiring the system to be powered down.
    Type: Application
    Filed: November 18, 2022
    Publication date: March 16, 2023
    Inventors: Sreejit CHAKRAVARTY, Rakesh KANDULA, Deep BAROT, Vishal VENDE
  • Patent number: 11257560
    Abstract: A die-to-die repeater circuit includes a transmit circuit coupled to a die-to-die interconnect, the transmit circuit including at least one flip flop to function as a part of a linear feedback shift register (LFSR) to transmit a value across the die-to-die interconnect for design for test (DFT) to check proper operation of the die-to-die interconnect, and a receive circuit coupled to the die-to-die interconnect, the receive circuit including at least one flip flop to function as part of a multiple input shift register (MISR).
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: February 22, 2022
    Assignee: INTEL CORPORATION
    Inventors: Sreejit Chakravarty, Fei Su, Puneet Gupta, Wei Ming Lim, Terrence Huat Hin Tan, Amit Sanghani, Anubhav Sinha, Sudheer V Badana, Rakesh Kandula, Adithya B. S.
  • Publication number: 20190096503
    Abstract: A die-to-die repeater circuit includes a transmit circuit coupled to a die-to-die interconnect, the transmit circuit including at least one flip flop to function as a part of a linear feedback shift register (LFSR) to transmit a value across the die-to-die interconnect for design for test (DFT) to check proper operation of the die-to-die interconnect, and a receive circuit coupled to the die-to-die interconnect, the receive circuit including at least one flip flop to function as part of a multiple input shift register (MISR).
    Type: Application
    Filed: September 27, 2017
    Publication date: March 28, 2019
    Inventors: Sreejit CHAKRAVARTY, Fei SU, Puneet GUPTA, Wei Ming LIM, Terrence Huat Hin TAN, Amit SANGHANI, Anubhav SINHA, Sudheer V BADANA, Rakesh KANDULA, Adithya B. S.