Patents by Inventor Rakesh Kumar Kuncha

Rakesh Kumar Kuncha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240102116
    Abstract: The present invention is directed towards a process of RT-PCR based diagnosis of SARS-CoV2 and other related respiratory viruses without storing and transporting the naso-pharyngeal and oro-pharyngeal swabs in Viral Testing Media directly after extracting the viral particles from the swabs in a suitable buffer, and using these extracts directly, without involving any steps of RNA isolation/extraction, for RT-PCR based diagnosis of SARS-CoV2. The present invention is also directed towards kits for time and cost-efficient diagnosis of SARS-CoV2 and other related respiratory viruses at efficacies matching or better than the efficacies of the gold-standard RT-PCR method starting from VTM transported swabs for diagnosing the same. The present invention also directs to variant process wherein the viral particles eluted in suitable buffers are further subjected to the conventional steps of RNA extraction before qRT-PCR.
    Type: Application
    Filed: March 3, 2021
    Publication date: March 28, 2024
    Inventors: Sai Uday Kiran Peddapuvala, Gokulan Coimbatore Gurumoorthy, Santosh Kumar Kuncha, Karthik Bharadwaj Tallapaka, Rakesh Kumar Mishra
  • Patent number: 9898572
    Abstract: A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: February 20, 2018
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Thomas Melde, Matthias U. Lehr, Thomas Herrmann, Jens Hassmann, Moritz Andreas Meyer, Rakesh Kumar Kuncha
  • Publication number: 20170235867
    Abstract: A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 17, 2017
    Inventors: Thomas Melde, Matthias U. Lehr, Thomas Herrmann, Jens Hassmann, Moritz Andreas Meyer, Rakesh Kumar Kuncha
  • Publication number: 20160154922
    Abstract: A method of manufacturing semiconductor devices employing optical proximity correction (OPC) is provided including providing a design layout of masks, performing OPC on the design layout to obtain a post OPC layout, performing post chemical mechanical polishing (CMP) topography simulations of a wafer to obtain the surface topography of the wafer, calculating a focus shift of a nominal focus caused by the surface topography of the wafer to obtain a shifted nominal focus, determining a process window based on the shifted nominal focus, simulating a nominal image based on the post OPC layout and the shifted nominal focus and process window images based on the post OPC layout and the process window, and identifying hotspots based on the simulated nominal and process window images.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 2, 2016
    Inventors: Rakesh Kumar Kuncha, Aravind Narayana Samy