Abstract: An artificial tissue construct for nerve repair and regeneration includes a biocompatible and biodegradable nerve guidance matrix comprising a plurality of biopolymers that include chitosan, gelatin, collagen and hyaluronic acid. A cross-linker includes glutaraldehyde. The nerve guidance matrix is formed as a three-dimensional scaffold polyelectrolyte complex (PEC). A subconfluent and grown monolayer of at least one of human mesenchymal stem cells, mesenchymal stem cells, differentiated Schwann cells and neuronal cells is on the biocompatible and biodegradable nerve guidance matrix for direct implantation or delivery. A method of making the artificial tissue construct is disclosed.

Abstract: A one-time programmable (OTP) memory has a plurality of pages. A predefined section of each page is configured to store error policy bits. When an indicator in a first predefined location has a first value, the page is configured to store data with error correction code (ECC) bits, and when the indicator has a second value, at least a portion of the page is configured to store data with redundancy. Address translation circuitry is configured to, in response to receiving an access address, use a second predefined location of an accessed page of the plurality of pages accessed by the access address to determine a physical address in the accessed page which corresponds to the access address.

Abstract: An integrated circuit (IC) includes a memory manager having a plurality of memory ports, each configured to communicate with a corresponding floating memory block. The IC includes a first interconnect for a first domain, wherein the first interconnect has a first set of fixed ports configured to communicate with memory blocks dedicated to the first domain and a first set of floating ports configured to communicate with the memory manager, and a second interconnect for a second domain, wherein the second interconnect has a second set of fixed ports configured to communicate with memory blocks dedicated to the second domain and a second set of floating ports configured to communicate with the memory manager. The memory manager is configured to allocate a first portion of the memory ports to the first set of floating ports and a second portion of the memory ports to the second set of floating ports.

Abstract: An active tamper detection circuit with bypass detection is provided. A bypass detection circuit is coupled to an active mesh loop. The bypass detector includes a voltage comparator with a variable hysteresis control circuit and a calibration engine. The bypass detector detects a change in impedance in the mesh when an attacker attempts to bypass the active loop using a wire. As part of a boot-up sequence, the calibration engine runs a hysteresis sweep on the voltage comparator and stores a hysteresis sweep boot-up signature. When bypass protection is enabled, the bypass detector runs a hysteresis sweep of the voltage comparator periodically at a predetermined interval. Each sweep generates a generated signature that is compared to the stored boot-up signature. Any signature mismatch will be signaled as an impedance mismatch, or tamper. The hysteresis step size is also programmable. The calibration engine can make small changes to the boot-up signature to allow for small voltage variations.

Abstract: A one-time programmable (OTP) memory has a plurality of pages. A predefined section of each page is configured to store error policy bits. When an indicator in a first predefined location has a first value, the page is configured to store data with error correction code (ECC) bits, and when the indicator has a second value, at least a portion of the page is configured to store data with redundancy. Address translation circuitry is configured to, in response to receiving an access address, use a second predefined location of an accessed page of the plurality of pages accessed by the access address to determine a physical address in the accessed page which corresponds to the access address.

Abstract: An integrated circuit includes a one-time programmable (OTP) memory having a plurality of pages and address translation circuitry. A first line of each page is configured to store error policy bits. When a first bit of the first line has a first value, the page is configured to store data with error correction code (ECC) bits, and when the first bit has a second value, at least a portion of the page is configured to store data with redundancy. The address translation circuitry is configured to, in response to receiving an access address, use the first line of an accessed page of the plurality of pages accessed by the access address to determine a physical address in the accessed page which corresponds to the access address.

Abstract: An integrated circuit includes a one-time programmable (OTP) memory having a plurality of pages and address translation circuitry. A first line of each page is configured to store error policy bits. When a first bit of the first line has a first value, the page is configured to store data with error correction code (ECC) bits, and when the first bit has a second value, at least a portion of the page is configured to store data with redundancy. The address translation circuitry is configured to, in response to receiving an access address, use the first line of an accessed page of the plurality of pages accessed by the access address to determine a physical address in the accessed page which corresponds to the access address.

Abstract: An active tamper detection circuit with bypass detection is provided. A bypass detection circuit is coupled to an active mesh loop. The bypass detector includes a voltage comparator with a variable hysteresis control circuit and a calibration engine. The bypass detector detects a change in impedance in the mesh when an attacker attempts to bypass the active loop using a wire. As part of a boot-up sequence, the calibration engine runs a hysteresis sweep on the voltage comparator and stores a hysteresis sweep boot-up signature. When bypass protection is enabled, the bypass detector runs a hysteresis sweep of the voltage comparator periodically at a predetermined interval. Each sweep generates a generated signature that is compared to the stored boot-up signature. Any signature mismatch will be signaled as an impedance mismatch, or tamper. The hysteresis step size is also programmable. The calibration engine can make small changes to the boot-up signature to allow for small voltage variations.

Abstract: A memory device having at least one output predicting a feasibility of whether the memory device will work properly at a different operating condition including a different supply voltage and/or a different operating frequency than the current supply voltage and/or the current operating frequency. A semiconductor device (e.g. a SoC chip) provides a test to either validate or invalidate the feasibility for the memory device to enter such a different operating condition based on read and write operations of the memory device in normal access cycles. The memory device is partitioned with at least a first memory unit and a second memory unit, which can be coupled to different back-bias voltages. This operating condition predicting function can be enabled or disabled by the semiconductor device in real time operation depending on the feasibility test results.

Abstract: A memory controller comprises a connection interface connected or connectable to a memory. The memory controller is arranged to read data from the memory via the connection interface. The memory controller further comprises a clock unit arranged to provide a data transfer clock signal having a first frequency. The data transfer clock signal may be provided to the memory via the connection interface. The data transfer clock signal is arranged for clocking a data transfer from the memory to the memory controller via the connection interface as well as an oversampling circuit arranged to sample a calibration data pattern read by the memory controller via the connection interface at a second frequency to provide an over-sampled calibration data pattern. The second frequency is larger than the first frequency. The memory controller is arranged to determine a timing shift of a data transfer from the memory to the memory controller based on the oversampled calibration data pattern.

Abstract: An integrated circuit includes an input/output pad, an input circuit, and an output circuit. The input circuit is coupled to the input/output pad that receives input signals including a wake-up signal that indicates when the integrated circuit is to switch from a power-down mode to an active mode. The output circuit is coupled to the input/output pad that provides output signals to the input/output pad. The output circuit includes a first P channel transistor in a well having a drain coupled to the input/output pad, and a source coupled to a power supply terminal. The power supply terminal receives a first power supply voltage during the active mode and is decoupled from any power supply during the power-down mode. The well is coupled to the wake-up signal in response to the wake-up signal indicating a change from the power-down mode to the active mode.

Abstract: A system for generating a tamper detection signal indicating tampering with one or more circuits of an integrated circuit (IC) includes both a static wire mesh and an active wire mesh. The wire meshes can be formed in the same layer over the circuits to be protected or in different layers. The wire meshes also may cover the entire chip area or only predetermined areas, such as over secure memory and register areas. The wire meshes are connected to a tamper detection module, which monitors the meshes and any signals transmitted via the meshes to detect attempts to access the protected circuits via micro-probing.

Abstract: An integrated circuit that supports both internal and external voltage regulators as well as various modes, such as a low power mode or a test mode, includes voltage regulator selection circuitry and power control circuitry. The regulator selection circuitry selects one of internal and external regulators based on two pin conditions. The power control circuitry controls ON/OFF status of the regulators corresponding to a power mode, including power-on reset, entering a low power mode, and wake-up from a low power mode.

Abstract: In an integrated circuit, a clock monitor circuit detects when an analog clock signal output by an on-chip crystal oscillator has stabilized. The clock monitor circuit uses an envelope follower circuit to monitor the envelope of the analog clock signal and compare the amplitude of the envelope with a predetermined amplitude value. When the predetermined value is reached and the envelope has remained steady for a predetermined time, an oscillator okay signal is generated. If an oscillator okay signal is not detected within another predetermined time, then an oscillator failure signal may be generated.

Abstract: A method and circuit for generating a shifted strobe signal for sampling data read from a memory device includes generating an instantiation of a shifted strobe signal by applying both a coarse adjustment delay value and a fine adjustment delay value to a clock. Data read from a predetermined, programmed memory location or locations of the memory device is sampled using the shifted strobe signal. At least one of the applying steps is repeated and the read data is sampled again using the current instantiation of the shifted strobe signal. The process is repeated until the current instantiation of the shifted strobe signal is aligned with a valid data window of the memory device. The method can be used in both single data rate and double data rate applications.

Abstract: Multiple resets in a system-on-chip (SOC) during boot where on-board regulators and low voltage detector circuits have different trimmed and untrimmed values may be avoided by the inclusion of a series of latches that latch the trimmed values during boot and retain the trim values even during a SOC reset event. The SOC is prevented from entering into a reset loop during boot or when exiting reset for any reason other than boot. A power-on-reset comparator circuit that does not depend on any trim values enables the latches and only clears the latched trim values if its own supply voltage falls below a preset level.

Abstract: In an integrated circuit, a clock monitor circuit detects when an analog clock signal output by an on-chip crystal oscillator has stabilized. The clock monitor circuit uses an envelope follower circuit to monitor the envelope of the analog clock signal and compare the amplitude of the envelope with a predetermined amplitude value. When the predetermined value is reached and the envelope has remained steady for a predetermined time, an oscillator okay signal is generated. If an oscillator okay signal is not detected within another predetermined time, then an oscillator failure signal may be generated.

Abstract: An integrated circuit that supports both internal and external voltage regulators as well as various modes, such as a low power mode or a test mode, includes voltage regulator selection circuitry and power control circuitry. The regulator selection circuitry selects one of internal and external regulators based on two pin conditions. The power control circuitry controls ON/OFF status of the regulators corresponding to a power mode, including power-on reset, entering a low power mode, and wake-up from a low power mode.

Abstract: Multiple resets in a system-on-chip (SOC) during boot where on-board regulators and low voltage detector circuits have different trimmed and untrimmed values may be avoided by the inclusion of a series of latches that latch the trimmed values during boot and retain the trim values even during a SOC reset event. The SOC is prevented from entering into a reset loop during boot or when exiting reset for any reason other than boot. A power-on-reset comparator circuit that does not depend on any trim values enables the latches and only clears the latched trim values if its own supply voltage falls below a preset level.

Abstract: A circuit for configuring an external memory includes a memory controller, a register, an OR gate, first and second input/output (IO) pads, and pull-up and pull-down resistors. When the circuit is in a high power mode, the memory controller refreshes the external memory by providing reset and clock enable signals to the external memory by way of the first and second IO pads. When the circuit is in a low power mode, the pull-up and pull-down resistors configure the external memory in a self-refresh mode. When the circuit exits the low power mode, the first and second IO pads are powered on. The OR gate receives and provides a control signal output by the register to the external memory by way of the first IO pad, which keeps the external memory in the self-refresh mode.