Patents by Inventor Rakshith Badarinath

Rakshith Badarinath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Housing of an ultrasonic sensor
    Patent number: 12625112
    Abstract: A housing of an ultrasonic sensor includes a plurality of layers of a housing material integrally connected together to form the housing. A first section of the housing has a first plurality of layers of the housing material each with a first thickness. A second section of the housing has a second plurality of layers of the housing material each with a second thickness. The second thickness is greater than the first thickness and an ultrasonic wave transmitted through the housing has a greater transmission efficiency in the first section than in the second section.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: May 12, 2026
    Assignee: TE CONNECTIVITY SOLUTIONS GmbH
    Inventors: Jessica H. B. Hemond, Michael Pedrick, Rakshith Badarinath
  • Housing of an Ultrasonic Sensor
    Publication number: 20250027909
    Abstract: A housing of an ultrasonic sensor includes a plurality of layers of a housing material integrally connected together to form the housing. A first section of the housing has a first plurality of layers of the housing material each with a first thickness. A second section of the housing has a second plurality of layers of the housing material each with a second thickness. The second thickness is greater than the first thickness and an ultrasonic wave transmitted through the housing has a greater transmission efficiency in the first section than in the second section.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 23, 2025
    Applicant: TE Connectivity Solutions GmbH
    Inventors: Jessica H. B. Hemond, Michael Pedrick, Rakshith Badarinath