Patents by Inventor Raleigh Bettiga

Raleigh Bettiga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10095280
    Abstract: A chassis includes a midplane defining a plurality of expansion sockets on one side and one or more motherboard sockets on the other. A modular motherboard is removably inserted in the chassis and engages the one or more motherboard sockets. An expansion card may engage with one or more of the motherboard sockets simultaneously. The expansion sockets are arranged in a coplanar and collinear manner to enable a planar expansion card to simultaneously insert within multiple expansion sockets. The motherboard allocates lanes to the expansion card in response to detecting a number of sockets occupied by the expansion card.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: October 9, 2018
    Assignee: Ciena Corporation
    Inventors: Raleigh Bettiga, Colin Wilson, Wayde Jaskela
  • Patent number: 9769958
    Abstract: A chassis defines a slot for receiving a motherboard. The motherboard is insertable within the slot and further defines a plurality of fan module receivers along an edge thereof. Fan modules insert within the fan modules receivers and are removable and insertable while the motherboard is inserted within the chassis. The motherboard defines a plurality of edge connectors and connectors of the plurality of fan modules engage the edge connectors. Alignment posts mount to the motherboard opposite the edge connectors and the fan modules include slots that engage the alignment posts to align the connectors of the fan modules with the edge connectors. The chassis includes a midplane defining a plurality of expansion sockets on one side and one or more motherboard sockets on the other. The expansion sockets are arranged in a coplanar and collinear manner to enable a planar expansion card to simultaneously insert within multiple expansion sockets.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: September 19, 2017
    Assignee: Ciena Corporation
    Inventors: Wayde Jaskela, Raleigh Bettiga
  • Publication number: 20170086332
    Abstract: A chassis defines a slot for receiving a motherboard. The motherboard is insertable within the slot and further defines a plurality of fan module receivers along an edge thereof. Fan modules insert within the fan modules receivers and are removable and insertable while the motherboard is inserted within the chassis. The motherboard defines a plurality of edge connectors and connectors of the plurality of fan modules engage the edge connectors. Alignment posts mount to the motherboard opposite the edge connectors and the fan modules include slots that engage the alignment posts to align the connectors of the fan modules with the edge connectors. The chassis includes a midplane defining a plurality of expansion sockets on one side and one or more motherboard sockets on the other. The expansion sockets are arranged in a coplanar and collinear manner to enable a planar expansion card to simultaneously insert within multiple expansion sockets.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Inventors: Wayde Jaskela, Raleigh Bettiga
  • Publication number: 20170083057
    Abstract: A chassis includes a midplane defining a plurality of expansion sockets on one side and one or more motherboard sockets on the other. A modular motherboard is removably inserted in the chassis and engages the one or more motherboard sockets. An expansion card may engage with one or more of the motherboard sockets simultaneously. The expansion sockets are arranged in a coplanar and collinear manner to enable a planar expansion card to simultaneously insert within multiple expansion sockets. The motherboard allocates lanes to the expansion card in response to detecting a number of sockets occupied by the expansion card.
    Type: Application
    Filed: September 21, 2015
    Publication date: March 23, 2017
    Inventors: Raleigh Bettiga, Colin Wilson, Wayde Jaskela