Patents by Inventor Ralf Criens

Ralf Criens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and an encapsulation for encapsulating electrical or electronic components or assemblies
    Patent number: 5376824
    Abstract: A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.
    Type: Grant
    Filed: January 8, 1992
    Date of Patent: December 27, 1994
    Assignee: Siemens Aktiengesellschaft
    Inventors: Siegfried Rauchmaul, Hans-Fr. Schmidt, Juergen Bednarz, Karl-Heinz Horsmann, Ralf Criens, Horst Scheffler, Hanns-Heinz Peltz
  • Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant
    Patent number: 5106785
    Abstract: A component or assembly is accommodated in a housing formed of at least two joined housing parts. Terminal legs are conducted toward the outside of the housing. In order to enhance a sealing effect, and thus for protection against internal corrosion, an outside encapsulation of a thermoplastic plastic is applied to the housing by injection molding at least in the region of the joints of the housing and in the exit region of the terminal legs. Particularly given the hermetically tight encapsulation of surface-wave filters, encircling sections having a low wall thickness are provided on the housing parts in their peripheral regions, these sections being fused to the outside encapsulation.
    Type: Grant
    Filed: January 16, 1990
    Date of Patent: April 21, 1992
    Assignee: Siemens Aktiengesellschaft
    Inventors: Siegfried Rauchmaul, Hans-Fr. Schmidt, Juergen Bednarz, Karl-Heinz Horsmann, Ralf Criens, Horst Scheffler, Hanns-Heinz Peltz