Patents by Inventor Ralf-Dieter Boehnke

Ralf-Dieter Boehnke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming at least one groove in a substrate layer
    Patent number: 5240550
    Abstract: A groove is formed in a substrate layer by ion etching. The substrate layer comprises a top layer having an etch rate S1 and a bottom layer having a different etch rate S2, in which first, grooves are formed having an initial depth which differs from the desired depth, after which the etching process is carried out without using a mask until the desired depth of the groove is attained.
    Type: Grant
    Filed: September 10, 1991
    Date of Patent: August 31, 1993
    Assignee: U.S. Philips Corp.
    Inventors: Ralf-Dieter Boehnke, Hans Dammann, Gert Rabe
  • Method of and device for providing thin layers by cathode sputtering
    Patent number: 4049523
    Abstract: A mould and supporting dish for dry-compressed powder targets which are constructed so that adsorbed residual gases can readily escape during the evacuation process of the cathode sputtering device via substantially all the surfaces of the powder target, so that the powder target is not torn or its structure damaged during the evacuation process. The adsorbed residual gases can escape through apertures in the bottom and side wall of the supporting dish.
    Type: Grant
    Filed: June 10, 1976
    Date of Patent: September 20, 1977
    Assignee: U.S. Philips Corporation
    Inventors: Ralf-Dieter Boehnke, Waldemar Gotze