Patents by Inventor Ralf Dorsheid

Ralf Dorsheid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically shielded through-wafer interconnect
    Patent number: 8018067
    Abstract: Through-Wafer Interconnections allow for the usage of cost-effective substrates for detector chips. According to an exemplary embodiment of the present invention, detecting element for application in an examination apparatus may be provided, comprising a wafer with a sensitive region and a coaxial through-wafer interconnect structure. This may reduce the susceptibility of the interconnection by providing an effective shielding.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: September 13, 2011
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Roger Steadman, Gereon Vogtmeier, Ralf Dorsheid
  • ELECTRICALLY SHIELDED THROUGH-WAFER INTERCONNECT
    Publication number: 20100171196
    Abstract: Through-Wafer Interconnections allow for the usage of cost-effective substrates for detector chips. According to an exemplary embodiment of the present invention, detecting element for application in an examination apparatus may be provided, comprising a wafer with a sensitive region and a coaxial through-wafer interconnect structure. This may reduce the susceptibility of the interconnection by providing an effective shielding.
    Type: Application
    Filed: August 15, 2006
    Publication date: July 8, 2010
    Applicant: Koninklijke Philips Electronics N.V.
    Inventors: Roger Steadman, Gereon Vogtmeier, Ralf Dorsheid