Abstract: A power semiconductor module has a substrate and an insulation layer and a metal layer arranged on the insulation layer, forming conductor tracks, comprising power semiconductor components arranged on the metal layer and conductively contacted with the metal layer. A pressure device arranged above the substrate in the normal direction of the insulation layer and having a pressure body and pressure elements running toward the substrate. The pressure elements each being connected to the pressure body to move resiliently in the normal direction via a spring element. The pressure body exerting a pressure onto the pressure elements in the direction toward the substrate via the spring elements, the pressure elements being arranged in such a way that, owing to the pressure exerted by the pressure body, they press onto power semiconductor component surrounding regions, surrounding the power semiconductor components, of the substrate.

Abstract: The present invention relates to an electrical press-in contact, particularly press-in pin contact, for transmitting electric current and/or electrical signals, comprising a press-in section and a mounting section which are mechanically coupled with each other via a relief section, and the relief section comprises a compensating portion and a stop portion, wherein the compensating portion allows a coupled relative movement of the press-in section and the mounting section, and the stop portion blocks a movement of press-in section and mounting section towards each other. Furthermore, the present invention relates to an electrical or electronic module or a printed circuit board comprising an electrical press-in contact according to the invention.

Abstract: The present invention relates to an electrical press-in contact, particularly press-in pin con-tact, for transmitting electric current and/or electrical signals, comprising a press-in section and a mounting section which are mechanically coupled with each other via a relief section, and the relief section comprises a compensating portion and a stop portion, wherein the compensating portion allows a coupled relative movement of the press-in section and the mounting section, and the stop portion blocks a movement of press-in section and mounting section towards each other. Furthermore, the present invention relates to an electrical or electronic module or a printed circuit board comprising an electrical press-in contact according to the invention.

Abstract: The present invention relates to an electric power module for assembly on a printed circuit board (46), comprising a circuit carrier (212) and a housing (214) for assembly of a heat sink (45), wherein the circuit carrier (212) is arranged on the printed circuit board (46) so as to be substantially perpendicular thereto in an assembled position. To improve a generic electric power module and a power device that receives this electric power module such that the electric power module has simplified assembly in the electric power device, the electric power module comprises at least one plug-in device (220) for attaching the power module to the printed circuit board (46).

Abstract: The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Abstract: An electronic module has a semiconductor arranged on a substrate. The semiconductor has an electrically conductive contact face on a side remote from the substrate. A contacting unit is configured to be at least partially elastically yielding. A support element is configured to press the contacting unit toward the substrate to make electrical contact. The contacting unit contacts the substrate and/or the contact face.

Abstract: The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Abstract: An electronic module has a semiconductor arranged on a substrate. The semiconductor has an electrically conductive contact face on a side remote from the substrate. A contacting unit is configured to be at least partially elastically yielding. A support element is configured to press the contacting unit toward the substrate to make electrical contact. The contacting unit contacts the substrate and/or the contact face.