Patents by Inventor Ralf Gordon CONRADS
Ralf Gordon CONRADS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10518555Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180) and a corresponding method of laser printing. The laser module comprises at least two laser arrays (110) of semiconductor lasers (115) and at least one optical element (170). The optical element (170) is adapted to image laser light emitted by the laser arrays (110), such that laser light of semiconductor lasers (115) of one laser array (110) is imaged to one pixel in a working plane (180) of the laser printing system (100) and an area element of the pixel is illuminated by means of at least two semiconductor lasers (115). The optical element does not project or focus laser light of each single semiconductor laser (115) to the working plane (180) but images the whole laser arrays to the working plane.Type: GrantFiled: December 16, 2014Date of Patent: December 31, 2019Assignee: PHILIPS PHOTONICS GMBHInventors: Ralf Gordon Conrads, Stephan Gronenborn, Gero Heusler, Holger Moench
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Patent number: 10159113Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.Type: GrantFiled: January 9, 2015Date of Patent: December 18, 2018Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Holger Möench, Guenther Hans Derra, Stephan Gronenborn, Pavel Pekarski, Johanna Sophie Kolb, Ralf Gordon Conrads
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Patent number: 10129986Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314,Type: GrantFiled: September 24, 2015Date of Patent: November 13, 2018Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Ralf Gordon Conrads, Hendrik Huisman, Carsten Deppe, Xi Gu, Gero Heusler
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Publication number: 20180220536Abstract: The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314,Type: ApplicationFiled: September 24, 2015Publication date: August 2, 2018Applicant: KONINKLIJKE PHILIPS N.V.Inventors: RALF GORDON CONRADS, HENDRIK HUISMAN, CARSTEN DEPPE, XI GU, GERO HEUSLER
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Patent number: 9882346Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip.Type: GrantFiled: December 10, 2014Date of Patent: January 30, 2018Assignee: KONINKLIJKE PHILIPS N.V.Inventors: Stephan Gronenborn, Gero Heusler, Ralf Gordon Conrads, Holger Moench
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Patent number: 9581392Abstract: An arrangement for cooling a plasma-based radiation source with a metal cooling liquid and a method for starting up a cooling arrangement of this type has a pump unit for conveying the metal cooling liquid from a reservoir to an immersion bath in a pipe portion that is connected to the reservoir in the conveying direction of the cooling circuit has at least one pump for conveying the metal cooling liquid through an external field effect of the at least one pump. A control unit for controlling the at least one pump controls the at least one pump at least temporarily in a pumping direction opposite to the conveying direction of the cooling circuit in order to generate a heating effect through external field effect on metal cooling liquid located in the pipe portion.Type: GrantFiled: February 27, 2015Date of Patent: February 28, 2017Assignee: USHIO Denki Kabushiki KaishaInventors: Gota Niimi, Dominik Marcel Vaudrevange, Ralf Gordon Conrads, Maghiel Jan Kole
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Publication number: 20160381732Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.Type: ApplicationFiled: January 9, 2015Publication date: December 29, 2016Applicant: Koninklijke Philips N.V.Inventors: HOLGER MÖENCH, GUENTHER HANS DERRA, STEPHAN GRONENBORN, PAVEL PEKARSKI, JOHANNA SOPHIE KOLB, RALF GORDON CONRADS
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Publication number: 20160315447Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip.Type: ApplicationFiled: December 10, 2014Publication date: October 27, 2016Inventors: STEPHAN GRONENBORN, GERO HEUSLER, RALF GORDON CONRADS, HOLGER MOENCH
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Publication number: 20160311230Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180) and a corresponding method of laser printing. The laser module comprises at least two laser arrays (110) of semiconductor lasers (115) and at least one optical element (170). The optical element (170) is adapted to image laser light emitted by the laser arrays (110), such that laser light of semiconductor lasers (115) of one laser array (110) is imaged to one pixel in a working plane (180) of the laser printing system (100) and an area element of the pixel is illuminated by means of at least two semiconductor lasers (115). The optical element does not project or focus laser light of each single semiconductor laser (115) to the working plane (180) but images the whole laser arrays to the working plane.Type: ApplicationFiled: December 16, 2014Publication date: October 27, 2016Inventors: RALF GORDON CONRADS, STEPHAN GRONENBORN, GERO HEUSLER, HOLGER MÖENCH
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Patent number: 9202659Abstract: An arrangements and methods for cooling a plasma-based radiation source having a revolving element which is to be cooled, particularly for application in EUV radiation sources, is disclosed. The revolving element is immersed in the metal coolant in a first vessel of a primary cooling circuit, and a secondary cooling circuit with a cooling liquid evaporating at the desired operating temperature of the metal coolant has a control unit for controlling at least one atomizing arrangement in a differentiated manner and for selectively controlling a heater in case the determined temperature falls below a minimum operating temperature of the metal coolant. The at least one atomizing arrangement in a cooling section selectively sprays individual wall regions of the first vessel with the cooling liquid depending on the determined temperature of the metal coolant.Type: GrantFiled: October 20, 2014Date of Patent: December 1, 2015Assignee: USHIO Denki Kabushiki KaishaInventors: Gota Niimi, Dominik Marcel Vaudrevange, Ralf Gordon Conrads, Maghiel Jan Kole, Wilhelmus V. J. Van Nunspeet, Johannes W. J. L. Cuijpers, Andre Matthias Prinz
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Publication number: 20150247679Abstract: An arrangement for cooling a plasma-based radiation source with a metal cooling liquid and a method for starting up a cooling arrangement of this type has a pump unit for conveying the metal cooling liquid from a reservoir to an immersion bath in a pipe portion that is connected to the reservoir in the conveying direction of the cooling circuit has at least one pump for conveying the metal cooling liquid through an external field effect of the at least one pump. A control unit for controlling the at least one pump controls the at least one pump at least temporarily in a pumping direction opposite to the conveying direction of the cooling circuit in order to generate a heating effect through external field effect on metal cooling liquid located in the pipe portion.Type: ApplicationFiled: February 27, 2015Publication date: September 3, 2015Inventors: Gota NIIMI, Dominik Marcel VAUDREVANGE, Ralf Gordon CONRADS, Maghiel Jan KOLE
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Publication number: 20150108365Abstract: An arrangements and methods for cooling a plasma-based radiation source having a revolving element which is to be cooled, particularly for application in EUV radiation sources, is disclosed. The revolving element is immersed in the metal coolant in a first vessel of a primary cooling circuit, and a secondary cooling circuit with a cooling liquid evaporating at the desired operating temperature of the metal coolant has a control unit for controlling at least one atomizing arrangement in a differentiated manner and for selectively controlling a heater in case the determined temperature falls below a minimum operating temperature of the metal coolant. The at least one atomizing arrangement in a cooling section selectively sprays individual wall regions of the first vessel with the cooling liquid depending on the determined temperature of the metal coolant.Type: ApplicationFiled: October 20, 2014Publication date: April 23, 2015Inventors: Gota NIIMI, Dominik Marcel VAUDREVANGE, Ralf Gordon CONRADS, Maghiel Jan KOLE, Wilhelmus V. J. VAN NUNSPEET, Johannes W. J. L. CUIJPERS, Andre Matthias PRINZ