Patents by Inventor Ralf Gottsche

Ralf Gottsche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080211025
    Abstract: A first SOI field effect transistor with predetermined transistor properties, comprising: a laterally delimited layer sequence with a gate-insulating layer and a gate region on an undoped substrate; a spacer layer having a predetermined thickness on at least a portion of the sidewalls of the laterally delimited layer sequence; and two source/drain regions in two surface regions of the substrate which are adjoined by the spacer layer, with a predetermined dopant concentration profile, the layer sequence and the spacer layer forming a shading structure that prevents dopant from being introduced into a surface region of the substrate between the two source/drain regions during the production of the first SOI field effect transistor, wherein the predetermined transistor properties of the first SOI field effect transistor are set by setting the thickness of the spacer layer and by the dopant concentration profile.
    Type: Application
    Filed: March 26, 2008
    Publication date: September 4, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Gottsche, Christian Pacha, Thomas Schulz, Werner Steinhogl
  • Patent number: 7416927
    Abstract: Method for producing a first SOI field effect transistor with predetermined transistor properties by forming a laterally delimited layer sequence with a gate-insulating layer and a gate region on an undoped substrate, forming a spacer layer having a predetermined thickness, on at least a portion of the sidewalls of the laterally delimited layer sequence, and forming two source/drain regions having a predetermined dopant concentration profile, by introducing dopant into two surface regions of the substrate which are adjoined by the spacer layer, the layer sequence and the spacer layer forming a shading structure that prevents dopant from being introduced into a surface region of the substrate between the two source/drain regions, wherein the predetermined transistor properties of the first SOI field effect transistor are set by setting the thickness of the spacer layer and by setting the dopant concentration profile.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: August 26, 2008
    Assignee: Infineon Technologies AG
    Inventors: Ralf Gottsche, Christian Pacha, Thomas Schulz, Werner Steinhogl
  • Publication number: 20050146369
    Abstract: Booster circuit (2), to which a first (3) and a second (4) signal are fed, wherein the booster circuit (2) is designed in such a way that it amplifies a voltage difference between the first (3) and the second (4) signal. Therefore, two output signals which are inverted with respect to one another, of a circuit section connected to the booster circuit (2) are amplified without loss of running time, a smaller additional area being required in comparison to conventional circuit variants.
    Type: Application
    Filed: October 29, 2004
    Publication date: July 7, 2005
    Inventors: Ralf Gottsche, Manuel Low
  • Publication number: 20050106789
    Abstract: Method for producing a first SOI field effect transistor with predetermined transistor properties by forming a laterally delimited layer sequence with a gate-insulating layer and a gate region on an undoped substrate, forming a spacer layer having a predetermined thickness, on at least a portion of the sidewalls of the laterally delimited layer sequence, and forming two source/drain regions having a predetermined dopant concentration profile, by introducing dopant into two surface regions of the substrate which are adjoined by the spacer layer, the layer sequence and the spacer layer forming a shading structure that prevents dopant from being introduced into a surface region of the substrate between the two source/drain regions, wherein the predetermined transistor properties of the first SOI field effect transistor are set by setting the thickness of the spacer layer and by setting the dopant concentration profile.
    Type: Application
    Filed: September 23, 2004
    Publication date: May 19, 2005
    Applicant: Infineon Technologies AG
    Inventors: Ralf Gottsche, Christian Pacha, Thomas Schulz, Werner Steinhogl