Abstract: An apparatus for binding stacks of flat parts comprising a fixing unit for fixing a stack consisting of a plurality of flat parts, a binder application device for applying liquid binder along a narrow face of the stack, and an irradiating unit for curing the binder by irradiating the binder on the narrow face of the stack, a light-emitting diode unit being used for irradiation.

Abstract: The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.

Abstract: An apparatus for binding stacks of flat parts comprising a fixing unit for fixing a stack consisting of a plurality of flat parts, a binder application device for applying liquid binder along a narrow face of the stack, and an irradiating unit for curing the binder by irradiating the binder on the narrow face of the stack, a light-emitting diode unit being used for irradiation.

Abstract: The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C4 to C20 ?-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C2 to C5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.

Abstract: The invention relates to a method for gluing labels on hydrophobic substrates, wherein a radiation cross-linking, pressure-sensitive adhesive is applied on the label or on the substrate on a surface opposite to the label and irradiated with UV or electron radiation, and label and substrate are then brought together and glued to one another. The pressure-sensitive adhesive is soluble in aqueous solutions. The label is selected from i) water permeable labels with a water uptake (Cobb value) greater than 0.2 g/m2 per 20 sec, and ii) perforated labels which have perforations or cut-outs of less than 10% on the glued surfaces. Furthermore, the invention describes a label, coated with a water-soluble, radiation curable, pressure sensitive adhesive, which has a high water uptake and/or optionally perforations or cut-outs on the glued surface.

Abstract: The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.

Abstract: Method of bonding labels to hydrophobic substrates, a pressure-sensitive hotmelt adhesive being applied wholly or partly to the label or to the substrate at an area opposite the label, then bringing label and substrate together and bonding them, characterized in that the pressure-sensitive hotmelt adhesive is water-soluble in alkaline solution and the label is selected from i) water-permeable labels having a water absorbency (Cobb value) of greater than 0.3 g/m2 per 20 sec, ii) perforated labels which on the bonded surfaces have a perforation or cutouts of below 10%. Further described is a label which is coated with a water-soluble pressure-sensitive hotmelt adhesive and which exhibits a high water absorbency and/or, where appropriate, contains perforations or cutouts on the bonded surface.

Abstract: The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C4 to C20 ?-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C2 to C5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.

Abstract: Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

Abstract: Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

Abstract: The invention relates to an adhesive system for labeling containers, more especially hollow containers, with wrap-around labels. The adhesive system comprises a pick-up adhesive and an overlap adhesive. It is characterized in that, in the wet state, the pick-up adhesive has sufficient wet bond strength for labeling and, in the dried state, does not adhere to at least one of the substrates. The pickup adhesive contains 5 to 85% by weight and preferably 5 to 60% by weight of at least one water-soluble polymer based on casein, starch, dextrin, glucose, polyvinyl alcohol, polyurethane or polyacrylic acid, 0.00 to 1.00% by weight and preferably 0.01 to 0.30% by weight of at least one defoamer, 0.00 to 1.00% by weight and preferably 0.01 to 0.30% by weight of at least one preservative and water as the balance to 100% by weight.